Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7094705 | Multi-step plasma treatment method to improve CU interconnect electrical performance | Keng-Chu Lin, Hui-Lin Chang, I-I Chen, Yung-Chen Lu | 2006-08-22 |
| 6693047 | Method for recycling semiconductor wafers having carbon doped low-k dielectric layers | Chih-Cheng Lu, Wen-Pin Chang | 2004-02-17 |