Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7482265 | UV curing of low-k porous dielectrics | Tien-I Bao, Shwang-Ming Cheug, Chen-Hua Yu | 2009-01-27 |
| 7465676 | Method for forming dielectric film to improve adhesion of low-k film | Fang Wen Tsai, Zhen-Cheng Wu, Chih-Lung Lin, Tien-I Bao, Shwang-Ming Jeng +1 more | 2008-12-16 |
| 7094705 | Multi-step plasma treatment method to improve CU interconnect electrical performance | Keng-Chu Lin, Hui-Lin Chang, Yung-Chen Lu, Syun-Ming Jeng | 2006-08-22 |