LL

Lih-Ping Li

TSMC: 16 patents #1,982 of 12,232Top 20%
CP Chinese Petroleum: 1 patents #26 of 91Top 30%
IT ITRI: 1 patents #5,197 of 9,619Top 55%
Overall (All Time): #278,424 of 4,157,543Top 7%
17
Patents All Time

Issued Patents All Time

Showing 1–17 of 17 patents

Patent #TitleCo-InventorsDate
7897505 Method for enhancing adhesion between layers in BEOL fabrication Chung-Chi Ko, Yung-Cheng Lu, Hui-Lin Chang, Chih-Hsien Lin 2011-03-01
7456093 Method for improving a semiconductor device delamination resistance Pi-Tsung Chen, Keng-Chu Lin, Hui-Lin Chang, Tien-I Bao, Yung-Cheng Lu +1 more 2008-11-25
7320945 Gradient low k material Syun-Ming Jang 2008-01-22
7288284 Post-cleaning chamber seasoning method Yung-Chen Lu 2007-10-30
7001833 Method for forming openings in low-k dielectric layers Tien-J Bao, Syun-Ming Jang 2006-02-21
6962869 SiOCH low k surface protection layer formation by CxHy gas plasma treatment Tien-I Bao, Hsin-Hsien Lu, Chung-Chi Ko, Aaron Song, Syun-Ming Jang 2005-11-08
6958524 Insulating layer having graded densification Yung-Cheng Lu 2005-10-25
6924242 SiOC properties and its uniformity in bulk for damascene applications Syun-Ming Jang, Chung-Chi Ko, Tien-I Bao, Al-Sen Liu 2005-08-02
6884659 Thin interface layer to improve copper etch stop Bi-Trong Chen, Lain-Jong Li, Syun-Ming Jang, Shu E Ku, Tien-I Bao 2005-04-26
6867126 Method to increase cracking threshold for low-k materials Yung-Chen Lu, Chung-Chi Ko 2005-03-15
6812043 Method for forming a carbon doped oxide low-k insulating layer Tien-I Bao, Chung-Chi Ko, Syun-Ming Jang 2004-11-02
6770570 Method of forming a semiconductor device with a substantially uniform density low-k dielectric layer Hsin-Hsien Lu, Syun-Ming Jang 2004-08-03
6756321 Method for forming a capping layer over a low-k dielectric with improved adhesion and reduced dielectric constant Chung-Chi Ko, Yung-Cheng Lu, Lain-Jong Li, Yu-Huei Chen, Shu E Ku 2004-06-29
6753269 Method for low k dielectric deposition Yung-Chen Lu, Syun-Ming Jang 2004-06-22
6623654 Thin interface layer to improve copper etch stop Bi-Trong Chen, Lain-Jong Li, Syun-Ming Jang, Shu E Ku, Tien-I Bao 2003-09-23
6602780 Method for protecting sidewalls of etched openings to prevent via poisoning Tsu Shih, Yung-Cheng Lu, Tien-I Bao, Chung-Chi Ko 2003-08-05
6426371 Sol materials Li-Mei Chen, Chao Wang, Hsin-Hsen Lu 2002-07-30