Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7244673 | Integration film scheme for copper / low-k interconnect | Tai-Chun Huang, Chih-Hsiang Yao, Yih-Hsiung Lin, Tien-I Bao, Yung-Cheng Lu | 2007-07-17 |
| 6887790 | Method of forming dummy copper plug to improve low k structure mechanical strength and plug fill uniformity | Tien-I Bao, Ying-Ho Chen | 2005-05-03 |
| 6884659 | Thin interface layer to improve copper etch stop | Lain-Jong Li, Syun-Ming Jang, Shu E Ku, Tien-I Bao, Lih-Ping Li | 2005-04-26 |
| 6623654 | Thin interface layer to improve copper etch stop | Lain-Jong Li, Syun-Ming Jang, Shu E Ku, Tien-I Bao, Lih-Ping Li | 2003-09-23 |