Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053894 | Surface treatment of metal interconnect lines | Wen-Kai Wan, Ming-Ta Lei, Baw-Ching Perng, Cheng-Chung Lin, Chia-Hui Lin +1 more | 2011-11-08 |
| 7244673 | Integration film scheme for copper / low-k interconnect | Tai-Chun Huang, Chih-Hsiang Yao, Tien-I Bao, Bi-Trong Chen, Yung-Cheng Lu | 2007-07-17 |
| 6955984 | Surface treatment of metal interconnect lines | Wen-Kai Wan, Ming LEI, Baw-Ching Perng, Cheng-Chung Lin, Chia-Hui Lin +1 more | 2005-10-18 |
| D362393 | Clock | — | 1995-09-19 |