Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6884659 | Thin interface layer to improve copper etch stop | Bi-Trong Chen, Lain-Jong Li, Syun-Ming Jang, Tien-I Bao, Lih-Ping Li | 2005-04-26 |
| 6756321 | Method for forming a capping layer over a low-k dielectric with improved adhesion and reduced dielectric constant | Chung-Chi Ko, Yung-Cheng Lu, Lain-Jong Li, Lih-Ping Li, Yu-Huei Chen | 2004-06-29 |
| 6623654 | Thin interface layer to improve copper etch stop | Bi-Trong Chen, Lain-Jong Li, Syun-Ming Jang, Tien-I Bao, Lih-Ping Li | 2003-09-23 |