Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8785321 | Low resistance and reliable copper interconnects by variable doping | Ting-Chu Ko, Ming-Hsing Tsai | 2014-07-22 |
| 8623760 | Process for improving copper line cap formation | Minghsing Tsai, Chen-Hua Yu, Ming-Shih Yeh | 2014-01-07 |
| 8349730 | Transitional interface between metal and dielectric in interconnect structures | Shau-Lin Shue | 2013-01-08 |
| 8193087 | Process for improving copper line cap formation | Minghsing Tsai, Chen-Hua Yu, Ming-Shih Yeh | 2012-06-05 |
| 8053892 | Low resistance and reliable copper interconnects by variable doping | Ting-Chu Ko, Ming-Hsing Tsai | 2011-11-08 |
| 7777344 | Transitional interface between metal and dielectric in interconnect structures | Shau-Lin Shue | 2010-08-17 |
| 7771579 | Electro chemical plating additives for improving stress and leveling effect | Ting-Chu Ko, Minghsing Tsai | 2010-08-10 |
| 7582557 | Process for low resistance metal cap | Chen-Hua Yu | 2009-09-01 |
| 7538434 | Copper interconnection with conductive polymer layer and method of forming the same | Minghsing Tsai, Hung-Wen Su, Shau-Lin Shue | 2009-05-26 |
| 7476306 | Method and apparatus for electroplating | Hung-Wen Su, Ming-Hsing Tsai | 2009-01-13 |
| 7446034 | Process for making a metal seed layer | Chen-Hua Yu | 2008-11-04 |
| 7413976 | Uniform passivation method for conductive features | Hung-Wen Su, Minghsing Tsai | 2008-08-19 |
| 7332435 | Silicide structure for ultra-shallow junction for MOS devices | Shih-Wei Chou, Hung-Wen Su, Minghsing Tsai | 2008-02-19 |
| 7312531 | Semiconductor device and fabrication method thereof | Hui-Lin Chang, Yung-Cheng Lu, Chung-Chi Ko, Pi-Tsung Chen, Shau-Lin Shue +2 more | 2007-12-25 |
| 7182849 | ECP polymer additives and method for reducing overburden and defects | Shaulin Shue | 2007-02-27 |
| 7026244 | Low resistance and reliable copper interconnects by variable doping | Ting-Chu Ko, Ming-Hsing Tsai | 2006-04-11 |