Issued Patents All Time
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400936 | Stacked memory cube with integrated thermal path for enhanced heat dissipation | Lipu Kris Chuang, Chung-Shi Liu, Han-Ping Pu, Hsin-Yu Pan, Ming-Kai Liu | 2025-08-26 |
| 12205888 | Semiconductor packages and methods of forming the same | Ching-Yu Huang, Han-Ping Pu, Ming-Kai Liu, Yung-Ping Chiang, Chang-Wen Huang +1 more | 2025-01-21 |
| 12165985 | Semiconductor device and method | Chen-Hua Yu, Hui-Jung Tsai, Hung-Jui Kuo, Chung-Shi Liu, Han-Ping Pu | 2024-12-10 |
| 12148735 | Memory device and manufacturing method thereof | Ching-Yu Huang, Han-Ping Pu, Ming-Kai Liu, Yung-Ping Chiang, Chang-Wen Huang +1 more | 2024-11-19 |
| 11929319 | Integrated fan-out packages and methods of forming the same | Ching-Yu Huang, Han-Ping Pu, Ming-Kai Liu, Yung-Ping Chiang, Chang-Wen Huang +1 more | 2024-03-12 |
| 11551999 | Memory device and manufacturing method thereof | Lipu Kris Chuang, Chung-Shi Liu, Han-Ping Pu, Hsin-Yu Pan, Ming-Kai Liu | 2023-01-10 |
| 11488908 | Semiconductor device and method | Chen-Hua Yu, Hui-Jung Tsai, Hung-Jui Kuo, Chung-Shi Liu, Han-Ping Pu | 2022-11-01 |
| 11335666 | Memory device and manufacturing method thereof | Ching-Yu Huang, Han-Ping Pu, Ming-Kai Liu, Yung-Ping Chiang, Chang-Wen Huang +1 more | 2022-05-17 |
| 11127708 | Package structure and method of manufacturing the same | Ming-Kai Liu, Han-Ping Pu, Yung-Ping Chiang, Chang-Wen Huang, Yu-Sheng Hsieh | 2021-09-21 |
| 11075159 | Integrated fan-out packages and methods of forming the same | Ching-Yu Huang, Han-Ping Pu, Ming-Kai Liu, Yung-Ping Chiang, Chang-Wen Huang +1 more | 2021-07-27 |
| 10879170 | Semiconductor package and manufacturing method thereof | Yung-Ping Chiang, Chung-Shi Liu, Han-Ping Pu, Ming-Kai Liu, Chang-Wen Huang +2 more | 2020-12-29 |
| 10629540 | Semiconductor device and method | Chen-Hua Yu, Hui-Jung Tsai, Hung-Jui Kuo, Chung-Shi Liu, Han-Ping Pu | 2020-04-21 |
| 10504865 | Package structure and method of manufacturing the same | Ming-Kai Liu, Han-Ping Pu, Yung-Ping Chiang, Chang-Wen Huang, Yu-Sheng Hsieh | 2019-12-10 |
| 9634001 | System and methods for converting planar design to FinFET design | Clement Hsingjen Wann, Chih-Sheng Chang, Yi-Tang Lin, Ming-Feng Shieh, Chung-Hsien Chen | 2017-04-25 |
| 9379108 | Contact structure of semiconductor device | Clement Hsingjen Wann, Ling-Yen Yeh, Chi-Wen Liu, Chi-Yuan Shih, Li-Chi Yu +2 more | 2016-06-28 |
| 9330970 | Structure and method for high performance interconnect | Clement Hsingjen Wann | 2016-05-03 |
| 9236253 | Strained structure of a semiconductor device | Chung-Hsien Chen, Chih-Hao Chang, Chih-Sheng Chang, Shou-Zen Chang, Clement Hsingjen Wann | 2016-01-12 |
| 9048317 | Contact structure of semiconductor device | Clement Hsingjen Wann, Ling-Yen Yeh, Chi-Wen Liu, Chi-Yuan Shih, Li-Chi Yu +2 more | 2015-06-02 |
| 8816444 | System and methods for converting planar design to FinFET design | Clement Hsingjen Wann, Chih-Sheng Chang, Yi-Tang Lin, Ming-Feng Shieh, Chung-Hsien Chen | 2014-08-26 |
| 8785321 | Low resistance and reliable copper interconnects by variable doping | Ming-Hsing Tsai, Chien-Hsueh Shih | 2014-07-22 |
| 8716863 | Structure and method for high performance interconnect | Hsingjen Wann | 2014-05-06 |
| 8101489 | Approach to reduce the contact resistance | Shau-Lin Shue | 2012-01-24 |
| 8053892 | Low resistance and reliable copper interconnects by variable doping | Ming-Hsing Tsai, Chien-Hsueh Shih | 2011-11-08 |
| 7771579 | Electro chemical plating additives for improving stress and leveling effect | Chien-Hsueh Shih, Minghsing Tsai | 2010-08-10 |
| 7259463 | Damascene interconnect structure with cap layer | Jui Jen Huang, Minghsing Tsai, Shau-Lin Shue, Hung-Wen Su | 2007-08-21 |