Issued Patents All Time
Showing 26–27 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7226860 | Method and apparatus for fabricating metal layer | Hsien-Ming Lee, Jing-Cheng Lin, Shing-Chyang Pan, Ming-Hsing Tsai, Hung-Wen Su +3 more | 2007-06-05 |
| 7026244 | Low resistance and reliable copper interconnects by variable doping | Ming-Hsing Tsai, Chien-Hsueh Shih | 2006-04-11 |