Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7182849 | ECP polymer additives and method for reducing overburden and defects | Chien-Hsueh Shih | 2007-02-27 |
| 6875692 | Copper electromigration inhibition by copper alloy formation | Chung-Liang Chang | 2005-04-05 |
| 6849173 | Technique to enhance the yield of copper interconnections | Chung-Liang Chang | 2005-02-01 |
| 6309964 | Method for forming a copper damascene structure over tungsten plugs with improved adhesion, oxidation resistance, and diffusion barrier properties using nitridation of the tungsten plug | Ming-Hsing Tsai | 2001-10-30 |
| 6077779 | Multi-step deposition to improve the conformality of ionized PVD films | Mei-Yun Wang | 2000-06-20 |
| 5970378 | Multi-step plasma treatment process for forming low resistance titanium nitride layer | Chen-Hua Yu | 1999-10-19 |
| 5702972 | Method of fabricating MOSFET devices | Chaochieh Tsai, Shun-Liang Hsu | 1997-12-30 |
| 5688718 | Method of CVD TiN barrier layer integration | — | 1997-11-18 |