Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7179732 | Interconnection structure and fabrication method thereof | Chih-Chao Yang, Gwo-Shil Yang, Ming-Shih Yeh, Jen-Kon Chen | 2007-02-20 |
| 6890851 | Interconnection structure and fabrication method thereof | Chih-Chao Yang, Gwo-Shil Yang, Ming-Shih Yeh, Jen-Kon Chen | 2005-05-10 |
| 6806182 | Method for eliminating via resistance shift in organic ILD | Darryl D. Restaino, Shahab Siddiqui, Erdem Kaltalioglu, Delores Bennett, Chih-Chih Liu +3 more | 2004-10-19 |
| 6750129 | Process for forming fusible links | Gwo-Shii Yang, Jen-Kon Chen, Hsueh-Chung Chen, Hans-Joachim Barth, Chih-Chien Liu +3 more | 2004-06-15 |
| 6617234 | Method of forming metal fuse and bonding pad | Sung-Hsiung Wang, Yimin Huang | 2003-09-09 |
| 6583489 | Method for forming interconnect structure with low dielectric constant | Sung-Hsiung Wang, Yi-Min Huang, Gwo-Shii Yang, Hsueh-Chung Chen, Chih-Chien Liu | 2003-06-24 |
| 6559004 | Method for forming three dimensional semiconductor structure and three dimensional capacitor | Gwo-Shii Yang, Hsueh-Chung Chen, Tong-Yu Chen, Sung-Hsiung Wang | 2003-05-06 |
| 6174812 | Copper damascene technology for ultra large scale integration circuits | Wen-Yi Hsieh, Water Lur | 2001-01-16 |