Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7968968 | Inductor utilizing pad metal layer | Chih-Ping Chao, Chia-Yu Su | 2011-06-28 |
| 7297629 | Ultra-thick metal-copper dual damascene process | — | 2007-11-20 |
| 7229879 | Metal-insulator-metal (MIM) capacitor structure formed with dual damascene structure | — | 2007-06-12 |
| 7074721 | Method for forming thick copper self-aligned dual damascene | — | 2006-07-11 |
| 7038266 | Metal-insulator-metal (MIM) capacitor structure formed with dual damascene structure | — | 2006-05-02 |
| 6903644 | Inductor device having improved quality factor | Shuo-Mao Chen, Heng-Ming Hsu, Jui-Feng Kuan, Chih-Ping Chao, Chih-Hsien Lin | 2005-06-07 |
| 6617234 | Method of forming metal fuse and bonding pad | Yimin Huang, Chiung-Sheng Hsiung | 2003-09-09 |
| 6583489 | Method for forming interconnect structure with low dielectric constant | Yi-Min Huang, Gwo-Shii Yang, Chiung-Sheng Hsiung, Hsueh-Chung Chen, Chih-Chien Liu | 2003-06-24 |
| 6559004 | Method for forming three dimensional semiconductor structure and three dimensional capacitor | Gwo-Shii Yang, Hsueh-Chung Chen, Chiung-Sheng Hsiung, Tong-Yu Chen | 2003-05-06 |
| 6417096 | Method for avoiding photo residue in dual damascene with acid treatment | Anseime Chen, Jun Maeda, Sheng-Yueh Chang | 2002-07-09 |
| 6355568 | Cleaning method for copper dual damascene process | Chan-Lon Yang | 2002-03-12 |