Issued Patents All Time
Showing 1–25 of 61 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12373626 | Method and non-transitory computer readable medium | Tsun-Yu Yang, Ren-Hong Fu, Chin-Cheng Kuo | 2025-07-29 |
| 12271029 | Directionally tunable optical reflector | Yu-Hao Chen, Hui Yu Lee, Chien-Te Wu | 2025-04-08 |
| 12204839 | Method for integrated circuit design | Tsun-Yu Yang, Ren-Hong Fu, Chin-Cheng Kuo | 2025-01-21 |
| 12197123 | Methods for making semiconductor-based integrated circuits | Yu-Hao Chen, Hui Yu Lee, Chien-Te Wu | 2025-01-14 |
| 12181722 | Structures and process flow for integrated photonic-electric ic package by using polymer waveguide | Yu-Hao Chen, Hui Yu Lee, Chung-Ming Weng, Chien-Te Wu | 2024-12-31 |
| 12055800 | Semiconductor structure | Yu-Hao Chen, Hui Yu Lee, Chien-Te Wu | 2024-08-06 |
| 12029123 | Semiconductor structure and method of manufacturing a semiconductor structure | Yu-Hao Chen, Hui Yu Lee | 2024-07-02 |
| 11994713 | Directionally tunable optical reflector | Yu-Hao Chen, Hui Yu Lee, Chien-Te Wu | 2024-05-28 |
| 11852967 | Methods for making semiconductor-based integrated circuits | Yu-Hao Chen, Hui Yu Lee, Chien-Te Wu | 2023-12-26 |
| 11754794 | Semiconductor device including optical through via and method of making | Yu-Hao Chen, Chung-Ming Weng, Tsung-Yuan Yu, Hui Yu Lee, Hung-Yi Kuo +1 more | 2023-09-12 |
| 11740415 | Structures and process flow for integrated photonic-electric IC package by using polymer waveguide | Yu-Hao Chen, Hui Yu Lee, Chung-Ming Weng, Chien-Te Wu | 2023-08-29 |
| 11609374 | Directionally tunable optical reflector | Yu-Hao Chen, Hui Yu Lee, Chien-Te Wu | 2023-03-21 |
| 11532613 | Structure and method for cooling three-dimensional integrated circuits | Hui Yu Lee, Chi-Wen Chang, Yi-Kan Cheng | 2022-12-20 |
| 11455453 | Integrated circuit design method, system and computer program product | Chi-Wen Chang | 2022-09-27 |
| 11314914 | Method and non-transitory computer readable medium of operating an electronic design automation platform for an optimal intgrated circuit design | Tsun-Yu Yang, Ren-Hong Fu, Chin-Cheng Kuo | 2022-04-26 |
| 11275880 | Region based shrinking methodology for integrated circuit layout migration | Chi-Wen Chang | 2022-03-15 |
| 11182528 | Electromigration sign-off tool | Yu-Tseng Hsien, Chin-Shen Lin, Ching-Shun Yang | 2021-11-23 |
| 11170150 | Method for making a semiconductor device | Chi-Wen Chang, Hui Yu Lee, Ya Yun Liu, Yi-Kan Cheng | 2021-11-09 |
| 10943052 | Integrated circuit design method, system and computer program product | Chi-Wen Chang | 2021-03-09 |
| 10910365 | Structure and method for cooling three-dimensional integrated circuits | Hui Yu Lee, Chi-Wen Chang, Yi-Kan Cheng | 2021-02-02 |
| 10763253 | Structure and method for cooling three-dimensional integrated circuits | Hui Yu Lee, Chi-Wen Chang, Yi-Kan Cheng | 2020-09-01 |
| 10719652 | Electromigration sign-off tool | Yu-Tseng Hsien, Chin-Shen Lin, Ching-Shun Yang | 2020-07-21 |
| 10685161 | Region based shrinking methodology for integrated circuit layout migration | Chi-Wen Chang | 2020-06-16 |
| 10634972 | Configurable heating device and method of using the same | Hui Yu Lee | 2020-04-28 |
| 10540475 | System for manufacturing a semiconductor device | Chi-Wen Chang, Hui Yu Lee, Ya Yun Liu, Yi-Kan Cheng | 2020-01-21 |