| 8062536 |
High density plasma chemical vapor deposition process |
Chih-Chien Liu, Ta-Shan Tseng, Wen-Bin Shieh, Juan-Yuan Wu, Shih-Wei Sun |
2011-11-22 |
$836,000 |
| 7718079 |
High density plasma chemical vapor deposition process |
Chih-Chien Liu, Ta-Shan Tseng, Wen-Bin Shieh, Juan-Yuan Wu, Shih-Wei Sun |
2010-05-18 |
$1,075,000 |
| 7514014 |
High density plasma chemical vapor deposition process |
Chih-Chien Liu, Ta-Shan Tseng, W.B. Shieh, J. Y. Wu, Shih-Wei Sun |
2009-04-07 |
$2,598,000 |
| 7449407 |
Air gap for dual damascene applications |
David Lee, Kuang-Chih Wang, Ming-Sheng Yang |
2008-11-11 |
$1,861,000 |
| 7378740 |
Dual damascene structure for the wiring-line structures of multi-level interconnects in integrated circuit |
Tri-Rung Yew, Yimin Huang, Shih-Wei Sun |
2008-05-27 |
$1,410,000 |
| 7271101 |
High density plasma chemical vapor deposition process |
Chih-Chien Liu, Ta-Shan Tseng, Wen-Bin Shieh, Juan-Yuan Wu, Shih-Wei Sun |
2007-09-18 |
$1,832,000 |
| 7253095 |
Air gap formation method for reducing undesired capacitive coupling between interconnects in an integrated circuit device |
David Lee, Kuang-Chih Wang, Ming-Sheng Yang |
2007-08-07 |
$1,687,000 |
| 7138329 |
Air gap for tungsten/aluminum plug applications |
David Lee, Kuang-Chih Wang, Ming-Sheng Yang |
2006-11-21 |
$3,301,000 |
| 7105426 |
Method of forming a semi-insulating region |
Joey Lai |
2006-09-12 |
$810,000 |
| 7078346 |
High density plasma chemical vapor deposition process |
Chih-Chien Liu, Ta-Shan Tseng, Wen-Bin Shieh, Juan-Yuan Wu, Shih-Wei Sun |
2006-07-18 |
$3,143,000 |
| 7064048 |
Method of forming a semi-insulating region |
Joey Lai |
2006-06-20 |
$1,278,000 |
| 7037802 |
Chemical mechanical polishing in forming semiconductor device |
Ming-Sheng Yang, Juan-Yuan Wu |
2006-05-02 |
$787,000 |
| 7018906 |
Chemical mechanical polishing for forming a shallow trench isolation structure |
Coming Chen, Juan-Yuan Wu |
2006-03-28 |
$1,011,000 |
| 7005363 |
Method of forming a semi-insulating region |
Joey Lai |
2006-02-28 |
$1,329,000 |
| 7001713 |
Method of forming partial reverse active mask |
Coming Chen, Juan-Yuan Wu |
2006-02-21 |
$1,280,000 |
| 6943110 |
Wafer processing apparatus and methods for depositing cobalt silicide |
David Lee, Kuang-Chih Wang |
2005-09-13 |
$1,155,000 |
| 6917109 |
Air gap structure and formation method for reducing undesired capacitive coupling between interconnects in an integrated circuit device |
David Lee, Kuang-Chih Wang, Ming-Sheng Yang |
2005-07-12 |
$3,646,000 |
| 6878627 |
Semiconductor device with cobalt silicide contacts and method of making the same |
David Lee, Kuang-Chih Wang |
2005-04-12 |
$1,560,000 |
| 6858487 |
Method of manufacturing a semiconductor device |
Ming-Sheng Yang |
2005-02-22 |
$1,865,000 |
| 6838357 |
Chemical mechanical polishing for forming a shallow trench isolation structure |
Coming Chen, Juan-Yuan Wu |
2005-01-04 |
$996,000 |
| 6810511 |
Method of designing active region pattern with shift dummy pattern |
Coming Chen, Juan-Yuan Wu |
2004-10-26 |
$1,953,000 |
| 6809022 |
Method for forming dielectric layers |
Chih-Chien Liu, Juan-Yuan Wu |
2004-10-26 |
$1,953,000 |
| 6790742 |
Chemical mechanical polishing in forming semiconductor device |
Ming-Sheng Yang, Juan-Yuan Wu |
2004-09-14 |
$1,288,000 |
| 6743721 |
Method and system for making cobalt silicide |
David Lee, Kuang-Chih Wang |
2004-06-01 |
$2,685,000 |
| 6627387 |
Method of photolithography |
Kevin Hsieh, Chih-Yung Lin, Chih-Hsiang Hsiao, Juan-Yuan Wu |
2003-09-30 |
$1,760,000 |