Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Dual damascene structure for the wiring-line structures of multi-level interconnects in integrated circuit

Dual damascene structure for the wiring-line structures of multi-level interconnects in integrated circuit

US Patent 7378740 · Granted May 27, 2008

Estimated economic value: $1,410,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Shopping cart2025
Systems and methods for training data generation for object identification and s2025
Image-based barcode decoding2025
Shopping cart2025
High performance image sensor2025
Neural network optimization method and apparatus2025
Semiconductor devices for image sensing2024
High performance image sensor2024
Device crack-stop structure to prevent damage due to dicing crack2024
Torch igniter for a combustor2024
Semiconductor imaging device having improved dark current performance2024
Three-dimensional bioprinting of cardiac patch with anisotropic and perfusable a2024