Issued Patents All Time
Showing 26–50 of 184 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6609954 | Method of planarization | Ming-Sheng Yang, Kuen-Jian Chen, Juan-Yuan Wu | 2003-08-26 |
| 6562731 | Method for forming dielectric layers | Chih-Chien Liu, Juan-Yuan Wu | 2003-05-13 |
| 6486040 | Chemical mechanical polishing for forming a shallow trench isolation structure | Coming Chen, Juan-Yuan Wu | 2002-11-26 |
| 6475865 | Method of fabricating semiconductor device | Gwo-Shii Yang, Tri-Rung Yew, Coming Chen | 2002-11-05 |
| 6448159 | Chemical mechanical polishing for forming a shallow trench isolation structure | Coming Chen, Juan-Yuan Wu | 2002-09-10 |
| 6362101 | Chemical mechanical polishing methods using low pH slurry mixtures | Ming-Sheng Yang, Juan-Yuan Wu, Shih-Wei Sun | 2002-03-26 |
| 6344408 | Method for improving non-uniformity of chemical mechanical polishing by over coating | Hsueh-Chung Chen, Ming-Sheng Yang, Juan-Yuan Wu | 2002-02-05 |
| 6337279 | Method of fabricating a shallow trench isolation | Chao Yuan Huang, Juan-Yuan Wu | 2002-01-08 |
| 6316330 | Method of fabricating a shallow trench isolation semiconductor device | Gwo-Shii Yang, Tri-Rung Yew, Coming Chen | 2001-11-13 |
| 6313028 | Method of fabricating dual damascene structure | Chao Yuan Huang, Juan-Yuan Wu | 2001-11-06 |
| 6306722 | Method for fabricating shallow trench isolation structure | Gwo-Shii Yang, Tri-Rung Yew, Coming Chen | 2001-10-23 |
| 6291111 | Method of trench polishing | Coming Chen, Juan-Yuan Wu, Jenn Tsao | 2001-09-18 |
| 6291295 | Method of forming a storage electrode of a capacitor on an ion-implanted isolation layer | Kuo-Tai Huang, Tri-Rung Yew | 2001-09-18 |
| 6271118 | Method of applying partial reverse mask | Juan-Yuan Wu | 2001-08-07 |
| 6265780 | Dual damascene structure for the wiring-line structures of multi-level interconnects in integrated circuit | Tri-Rung Yew, Yimin Huang, Shih-Wei Sun | 2001-07-24 |
| 6265313 | Method of manufacturing copper interconnect | Yimin Huang, Tri-Rung Yew | 2001-07-24 |
| 6251769 | Method of manufacturing contact pad | Tri-Rung Yew, Kuo-Tai Huang | 2001-06-26 |
| 6251783 | Method of manufacturing shallow trench isolation | Tri-Rung Yew, Kuo-Tai Huang, Gwo-Shii Yang | 2001-06-26 |
| 6246119 | Structure of a dual damascene | Juan-Yuan Wu | 2001-06-12 |
| 6245380 | Method of forming bonding pad | Shih-Wei Sun, Wen-Yi Hsieh, Kun-Chih Wang | 2001-06-12 |
| 6239018 | Method for forming dielectric layers | Chih-Chien Liu, Juan-Yuan Wu | 2001-05-29 |
| 6238972 | Method for increasing capacitance | Tri-Rung Yew, Shih-Wei Sun | 2001-05-29 |
| 6232161 | Method for forming a dummy active pattern | Coming Chen | 2001-05-15 |
| 6228742 | Method of fabricating shallow trench isolation structure | Tri-Rung Yew, Gwo-Shii Yang | 2001-05-08 |
| 6228209 | Equipment for forming a glue layer of an opening | Coming Chen, Juan-Yuan Wu | 2001-05-08 |