Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12211782 | Semiconductor package dielectric susbtrate including a trench | Hua-Wei Tseng, Ming-Shih Yeh, Der-Chyang Yeh | 2025-01-28 |
| 12159853 | Package structure including IPD and method of forming the same | Hua-Wei Tseng, Shao-Yun Chen, Li-Hsien Huang, An-Jhih Su, Ming-Shih Yeh +1 more | 2024-12-03 |
| 11984410 | Air channel formation in packaging process | Wan-Yu Lee, Chiang Lin, Hua-Wei Tseng, Li-Hsien Huang, Yu-Hsiang Hu | 2024-05-14 |
| 11961796 | Semiconductor package dielectric substrate including a trench | Hua-Wei Tseng, Ming-Shih Yeh, Der-Chyang Yeh | 2024-04-16 |
| 11682637 | Air channel formation in packaging process | Wan-Yu Lee, Chiang Lin, Hua-Wei Tseng, Li-Hsien Huang, Yu-Hsiang Hu | 2023-06-20 |
| 11587900 | Package structure including IPD and method of forming the same | Hua-Wei Tseng, Shao-Yun Chen, Li-Hsien Huang, An-Jhih Su, Ming-Shih Yeh +1 more | 2023-02-21 |
| 11177142 | Method for dicing integrated fan-out packages without seal rings | Li-Hsien Huang, An-Jhih Su, Ming-Shih Yeh, Der-Chyang Yeh | 2021-11-16 |
| 11088094 | Air channel formation in packaging process | Wan-Yu Lee, Chiang Lin, Hua-Wei Tseng, Li-Hsien Huang, Yu-Hsiang Hu | 2021-08-10 |
| 10867928 | Semiconductor device and manufacturing method thereof | Kuan-Chung Lu, An-Jhih Su, Der-Chyang Yeh, Li-Hsien Huang, Ming-Shih Yeh | 2020-12-15 |
| 10756037 | Package structure and fabricating method thereof | Li-Hsien Huang, An-Jhih Su, Der-Chyang Yeh, Hua-Wei Tseng, Ming-Shih Yeh | 2020-08-25 |
| 10720409 | Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same | Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen, Li-Hsien Huang, Wei-Yu Chen +1 more | 2020-07-21 |
| 10672741 | Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same | Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen, Li-Hsien Huang, Wei-Yu Chen +1 more | 2020-06-02 |