Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159853 | Package structure including IPD and method of forming the same | Hua-Wei Tseng, Yueh-Ting Lin, Li-Hsien Huang, An-Jhih Su, Ming-Shih Yeh +1 more | 2024-12-03 |
| 11587900 | Package structure including IPD and method of forming the same | Hua-Wei Tseng, Yueh-Ting Lin, Li-Hsien Huang, An-Jhih Su, Ming-Shih Yeh +1 more | 2023-02-21 |
| 9991207 | Test key strcutures, integrated circuit packages and methods of forming the same | Hsien-Wei Chen, Li-Hsien Huang | 2018-06-05 |
| 9842829 | Chip package structure and method for forming the same | Hsien-Wei Chen, An-Jhih Su | 2017-12-12 |