Issued Patents All Time
Showing 1–25 of 98 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374651 | Wafer bonding method | Yung-Chi Lin, Wen-Chih Chiou, Chen-Hua Yu | 2025-07-29 |
| 12322680 | Semiconductor device having backside interconnect structure on through substrate via | Yung-Chi Lin, Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Hong-Ye Shih +3 more | 2025-06-03 |
| 12276838 | Semiconductor device and manufacturing method thereof having grating coupled dies and nanostructures | Yu-Kuang Liao, Jia-Xsing Li, Ping-Jung Wu, Wen-Chih Chiou, Chen-Hua Yu | 2025-04-15 |
| 12278203 | Semiconductor structure and manufacturing method thereof | Chen-Yu Tsai, Ku-Feng Yang, Wen-Chih Chiou | 2025-04-15 |
| 12249566 | 3DIC with gap-fill structures and the method of manufacturing the same | Ping-Jung Wu, Ken-Yu Chang, Hao-Wen Ko | 2025-03-11 |
| 12237284 | Semiconductor structure comprising dummy feature interposed between the bonding connectors | Chen-Yu Tsai, Ku-Feng Yang, Wen-Chih Chiou | 2025-02-25 |
| 12159860 | Singulation and bonding methods and structures formed thereby | Chen-Hua Yu, Wen-Chih Chiou | 2024-12-03 |
| 12142485 | Semiconductor structure and manufacturing method thereof | Hung-Pin Chang, Wen-Chih Chiou | 2024-11-12 |
| 12142524 | Via for component electrode connection | Chen-Hua Yu, Chi-Hsi Wu, Wen-Chih Chiou, Der-Chyang Yeh, Ming-Shih Yeh +1 more | 2024-11-12 |
| 12074064 | TSV structure and method forming same | Ming-Tsu Chung, Ku-Feng Yang, Wen-Chih Chiou, Chen-Hua Yu | 2024-08-27 |
| 12015008 | Wafer bonding method | Yung-Chi Lin, Wen-Chih Chiou, Chen-Hua Yu | 2024-06-18 |
| 11961800 | Via for semiconductor device connection and methods of forming the same | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Wen-Chih Chiou, Der-Chyang Yeh +1 more | 2024-04-16 |
| 11948920 | Semiconductor device and method for manufacturing the same, and semiconductor package | I-Chun Hsu, Yan-Zuo Tsai, Chia-Yin Chen, Yang-Chih Hsueh, Yung-Chi Lin +1 more | 2024-04-02 |
| 11855021 | Semiconductor structure with through substrate vias and manufacturing method thereof | Yung-Chi Lin, Chen-Hua Yu, Wen-Chih Chiou | 2023-12-26 |
| 11823979 | Method of forming semiconductor device having backside interconnect structure on through substrate via | Yung-Chi Lin, Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Hong-Ye Shih +3 more | 2023-11-21 |
| 11774675 | Semiconductor device and manufacturing method thereof | Yu-Kuang Liao, Jia-Xsing Li, Ping-Jung Wu, Wen-Chih Chiou, Chen-Hua Yu | 2023-10-03 |
| 11756883 | Through via structure and method | Yung-Chi Lin, Hsin-Yu Chen, Lin-Chih Huang, Wen-Chih Chiou | 2023-09-12 |
| 11728296 | Interconnect structure and method of forming same | Hsiao Yun Lo, Lin-Chih Huang, Tasi-Jung Wu, Hsin-Yu Chen, Yung-Chi Lin +2 more | 2023-08-15 |
| 11594420 | Semiconductor structure and manufacturing method thereof | Hung-Pin Chang, Wen-Chih Chiou | 2023-02-28 |
| 11545392 | Semiconductor component having through-silicon vias | Chen-Hua Yu, Cheng-Hung Chang, Ebin Liao, Chia-Lin Yu, Hsiang-Yi Wang +4 more | 2023-01-03 |
| 11527439 | TSV structure and method forming same | Ming-Tsu Chung, Ku-Feng Yang, Wen-Chih Chiou, Chen-Hua Yu | 2022-12-13 |
| 11487060 | Semiconductor device with nanostructures aligned with grating coupler and manufacturing method thereof | Yu-Kuang Liao, Jia-Xsing Li, Ping-Jung Wu, Wen-Chih Chiou, Chen-Hua Yu | 2022-11-01 |
| 11469138 | Via for coupling attached component upper electrode to substrate | Chen-Hua Yu, Chi-Hsi Wu, Wen-Chih Chiou, Der-Chyang Yeh, Ming-Shih Yeh +1 more | 2022-10-11 |
| 11444020 | Via for semiconductor device connection and methods of forming the same | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Wen-Chih Chiou, Der-Chyang Yeh +1 more | 2022-09-13 |
| 11437344 | Wafer bonding method | Yung-Chi Lin, Wen-Chih Chiou, Chen-Hua Yu | 2022-09-06 |