Issued Patents All Time
Showing 26–50 of 98 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11355475 | Singulation and bonding methods and structures formed thereby | Chen-Hua Yu, Wen-Chih Chiou | 2022-06-07 |
| 11063008 | Semiconductor structure and manufacturing method thereof | Yung-Chi Lin, Chen-Hua Yu, Wen-Chih Chiou | 2021-07-13 |
| 11056419 | Semiconductor device having backside interconnect structure on through substrate via and method of forming the same | Yung-Chi Lin, Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Hong-Ye Shih +3 more | 2021-07-06 |
| 11037904 | Singulation and bonding methods and structures formed thereby | Chen-Hua Yu, Wen-Chih Chiou | 2021-06-15 |
| 11004741 | Profile of through via protrusion in 3DIC interconnect | Jiung Wu, Kuan-Liang Lai, Ming-Tsu Chung, Hong-Ye Shih, Ku-Feng Yang +3 more | 2021-05-11 |
| 10867963 | Die stack structure and method of fabricating the same | Chia-Hao Hsu, Chien-Ming Chiu, Yung-Chi Lin, Wen-Chih Chiou | 2020-12-15 |
| 10867943 | Die structure, die stack structure and method of fabricating the same | Yi-Hsiu Chen, Wen-Chih Chiou, Tung-Hsien Wu | 2020-12-15 |
| 10811374 | Interconnect structure and method of forming same | Hsiao Yun Lo, Lin-Chih Huang, Tasi-Jung Wu, Hsin-Yu Chen, Yung-Chi Lin +2 more | 2020-10-20 |
| 10784162 | Method of making a semiconductor component having through-silicon vias | Chen-Hua Yu, Cheng-Hung Chang, Ebin Liao, Chia-Lin Yu, Hsiang-Yi Wang +4 more | 2020-09-22 |
| 10714423 | Through via structure and method | Yung-Chi Lin, Hsin-Yu Chen, Lin-Chih Huang, Wen-Chih Chiou | 2020-07-14 |
| 10622302 | Via for semiconductor device connection and methods of forming the same | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Wen-Chih Chiou, Der-Chyang Yeh +1 more | 2020-04-14 |
| 10566237 | Profile of through via protrusion in 3DIC interconnect | Jiung Wu, Kuan-Liang Lai, Ming-Tsu Chung, Hong-Ye Shih, Ku-Feng Yang +3 more | 2020-02-18 |
| 10535586 | Robust through-silicon-via structure | Yung-Chi Lin, Wen-Chih Chiou | 2020-01-14 |
| 10510641 | Semiconductor device having backside interconnect structure on through substrate via and method of forming the same | Yung-Chi Lin, Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Hong-Ye Shih +3 more | 2019-12-17 |
| 10396014 | Robust through-silicon-via structure | Yung-Chi Lin, Wen-Chih Chiou | 2019-08-27 |
| 10290604 | Substrateless integrated circuit packages and methods of forming same | Lin-Chih Huang, Hung-An Teng, Hsin-Yu Chen, Cheng-Chieh Hsieh | 2019-05-14 |
| 10163705 | Profile of through via protrusion in 3DIC interconnect | Jiung Wu, Kuan-Liang Lai, Ming-Tsu Chung, Hong-Ye Shih, Ku-Feng Yang +3 more | 2018-12-25 |
| 10157866 | Interconnect structure and method of forming same | Hsiao Yun Lo, Lin-Chih Huang, Tasi-Jung Wu, Hsin-Yu Chen, Yung-Chi Lin +2 more | 2018-12-18 |
| 10115634 | Semiconductor component having through-silicon vias and method of manufacture | Chen-Hua Yu, Cheng-Hung Chang, Ebin Liao, Chia-Lin Yu, Hsiang-Yi Wang +4 more | 2018-10-30 |
| 10074595 | Self-alignment for redistribution layer | Ku-Feng Yang, Ming-Tsu Chung, Hong-Ye Shih, Jiung Wu, Chen-Yu Tsai +2 more | 2018-09-11 |
| 10032698 | Interconnection structure with confinement layer | Hsiao Yun Lo, Yung-Chi Lin, Yang-Chih Hsueh, Wen-Chih Chiou | 2018-07-24 |
| 9978607 | Through via structure and method | Yung-Chi Lin, Hung-Pin Chang, Wen-Chih Chiou | 2018-05-22 |
| 9953920 | Interconnect structure and method | Hsin-Yu Chen, Ku-Feng Yang, Tasi-Jung Wu, Lin-Chih Huang, Yuan-Hung Liu +1 more | 2018-04-24 |
| 9865523 | Robust through-silicon-via structure | Yung-Chi Lin, Wen-Chih Chiou | 2018-01-09 |
| 9847256 | Methods for forming a device having a capped through-substrate via structure | Yung-Chi Lin, Yen-Hung Chen, Yin Chen, Ebin Liao, Ku-Feng Yang +1 more | 2017-12-19 |