Issued Patents All Time
Showing 51–75 of 98 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842825 | Substrateless integrated circuit packages and methods of forming same | Lin-Chih Huang, Hung-An Teng, Hsin-Yu Chen, Cheng-Chieh Hsieh | 2017-12-12 |
| 9831177 | Through via structure | Yung-Chi Lin, Hsin-Yu Chen, Lin-Chih Huang, Wen-Chih Chiou | 2017-11-28 |
| 9786580 | Self-alignment for redistribution layer | Ku-Feng Yang, Ming-Tsu Chung, Hong-Ye Shih, Jiung Wu, Chen-Yu Tsai +2 more | 2017-10-10 |
| 9773701 | Methods of making integrated circuits including conductive structures through substrates | Yuan-Hung Liu, Ku-Feng Yang, Pei-Ching Kuo, Ming-Tsu Chung, Hsin-Yu Chen +1 more | 2017-09-26 |
| 9748190 | Low cost and ultra-thin chip on wafer on substrate (CoWoS) formation | Hsin-Yu Chen, Lin-Chih Huang, Tasi-Jung Wu, Wen-Chih Chiou | 2017-08-29 |
| 9679859 | Interconnect structure and method of forming same | Hsiao Yun Lo, Lin-Chih Huang, Tasi-Jung Wu, Hsin-Yu Chen, Yung-Chi Lin +2 more | 2017-06-13 |
| 9673132 | Interconnection structure with confinement layer | Hsiao Yun Lo, Yung-Chi Lin, Yang-Chih Hsueh, Wen-Chih Chiou | 2017-06-06 |
| 9514986 | Device with capped through-substrate via structure | Yung-Chi Lin, Yen-Hung Chen, Yin Chen, Ebin Liao, Ku-Feng Yang +1 more | 2016-12-06 |
| 9449898 | Semiconductor device having backside interconnect structure through substrate via and method of forming the same | Yung-Chi Lin, Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Hong-Ye Shih +3 more | 2016-09-20 |
| 9418923 | Semiconductor component having through-silicon vias and method of manufacture | Chen-Hua Yu, Cheng-Hung Chang, Ebin Liao, Chia-Lin Yu, Hsiang-Yi Wang +4 more | 2016-08-16 |
| 9373575 | TSV structures and methods for forming the same | Yung-Chi Lin, Hsin-Yu Chen, Wen-Chih Chiou, Ku-Feng Yang, Jing-Cheng Lin | 2016-06-21 |
| 9263382 | Through substrate via structures and methods of forming the same | Ku-Feng Yang, Yi-Hsiu Chen, Ebin Liao, Yuan-Hung Liu, Wen-Chih Chiou | 2016-02-16 |
| 9252110 | Interconnect structure and method of forming same | Hsiao Yun Lo, Lin-Chih Huang, Tasi-Jung Wu, Hsin-Yu Chen, Yung-Chi Lin +2 more | 2016-02-02 |
| 9240349 | Interconnect structures for substrate | Chen-Hua Yu, Wen-Chih Chiou, Shin-Puu Jeng | 2016-01-19 |
| 9112007 | Through via structure and method | Yung-Chi Lin, Hsin-Yu Chen, Lin-Chih Huang, Wen-Chih Chiou | 2015-08-18 |
| 9087878 | Device with through-silicon via (TSV) and method of forming the same | Chen-Hua Yu, Wen-Chih Chiou, Ebin Liao | 2015-07-21 |
| 9059262 | Integrated circuits including conductive structures through a substrate and methods of making the same | Yuan-Hung Liu, Ku-Feng Yang, Pei-Ching Kuo, Ming-Tsu Chung, Hsin-Yu Chen +1 more | 2015-06-16 |
| 9006101 | Interconnect structure and method | Hsin-Yu Chen, Ku-Feng Yang, Tasi-Jung Wu, Lin-Chih Huang, Yuan-Hung Liu +1 more | 2015-04-14 |
| 8994188 | Interconnect structures for substrate | Chen-Hua Yu, Wen-Chih Chiou, Shin-Puu Jeng | 2015-03-31 |
| 8956966 | TSV structures and methods for forming the same | Yung-Chi Lin, Hsin-Yu Chen, Wen-Chih Chiou, Ku-Feng Yang, Jing-Cheng Lin | 2015-02-17 |
| 8951838 | Low cost and ultra-thin chip on wafer on substrate (CoWoS) formation | Hsin-Yu Chen, Lin-Chih Huang, Tasi-Jung Wu, Wen-Chih Chiou | 2015-02-10 |
| 8847388 | Bump with protection structure | Chen-Hua Yu, Hung-Pin Chang, An-Jhih Su, Wen-Chih Chiou, Shin-Puu Jeng | 2014-09-30 |
| 8841773 | Multi-layer interconnect structure for stacked dies | Hung-Pin Chang, Chien-Ming Chiu, Shau-Lin Shue, Chen-Hua Yu | 2014-09-23 |
| 8836085 | Cost-effective TSV formation | Ku-Feng Yang, Yung-Chi Lin, Hung-Pin Chang, Wen-Chih Chiou | 2014-09-16 |
| 8835313 | Interconnect barrier structure and method | Chen-Hua Yu, Wen-Chih Chiou | 2014-09-16 |