Issued Patents All Time
Showing 1–25 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12433006 | Semiconductor device with conductive liners over silicide structures and method of making the semiconductor device | Kuan-Kan Hu, Shuen-Shin Liang, Chia-Hung Chu, Po-Chin Chang, Hsu-Kai Chang +8 more | 2025-09-30 |
| 12400853 | Method of forming conductive feature including cleaning step | Cheng-Wei Chang, Min-Hsiu Hung, Chun-I Tsai, Yi-Ying Liu | 2025-08-26 |
| 12362198 | Interface tool and methods of operation | Yu-Syuan Cai, Chen-Yuan Kao, Chia-Han Lai, Hong-Ming Wu, Yu-Chan Tsai +1 more | 2025-07-15 |
| 12327788 | Gate to source drain interconnects | Shuen-Shin Liang, Chia-Hung Chu, Po-Chin Chang, Tzu-Pei Chen, Hung-Yi Huang +6 more | 2025-06-10 |
| 12300539 | Source/drain contact formation methods and devices | Cheng-Wei Chang, Yu-Ming Huang, Ethan Tseng, Yi-Ying Liu | 2025-05-13 |
| 12252783 | Chemical vapor deposition for uniform tungsten growth | Pin-Wen Chen, Yuan-Chen Hsu | 2025-03-18 |
| 12249566 | 3DIC with gap-fill structures and the method of manufacturing the same | Ping-Jung Wu, Hao-Wen Ko, Tsang-Jiuh Wu | 2025-03-11 |
| 12191199 | Contact metallization process | Tien-Pei Chou, Sheng-Hsuan Lin, Yueh-Ching Pai, Yu-Ting Lin | 2025-01-07 |
| 12148659 | Contact conductive feature formation and structure | Chun-I Tsai, Ming-Hsing Tsai, Wei-Jung Lin | 2024-11-19 |
| 12057397 | Capping layer for liner-free conductive structures | Shuen-Shin Liang, Chun-I Tsai, Chih-Wei Chang, Chun-Hsien Huang, Hung-Yi Huang +4 more | 2024-08-06 |
| 12020981 | Conductive feature formation and structure | Yu-Shih Wang, Chun-I Tsai, Shian Wei Mao, Ming-Hsing Tsai, Wei-Jung Lin | 2024-06-25 |
| 11955329 | Method of forming conductive feature including cleaning step | Cheng-Wei Chang, Min-Hsiu Hung, Chun-I Tsai, Yi-Ying Liu | 2024-04-09 |
| 11929314 | Interconnect structures including a fin structure and a metal cap | Chun-Hsien Huang, Peng-Fu Hsu, Yu-Syuan Cai, Min-Hsiu Hung, Chen-Yuan Kao +4 more | 2024-03-12 |
| 11817384 | Interconnect structure and manufacturing method for the same | Shuen-Shin Liang, Hung-Yi Huang, Chien-Kuo Chang, Chi-Hung Chuang, Kai-Yi Chu +7 more | 2023-11-14 |
| 11798843 | Conductive feature formation and structure | Yu-Shih Wang, Chun-I Tsai, Shian Wei Mao, Ming-Hsing Tsai, Wei-Jung Lin | 2023-10-24 |
| 11742240 | Source/drain contact formation methods and devices | Cheng-Wei Chang, Yu-Ming Huang, Ethan Tseng, Yi-Ying Liu | 2023-08-29 |
| 11676859 | Contact conductive feature formation and structure | Chun-I Tsai, Ming-Hsing Tsai, Wei-Jung Lin | 2023-06-13 |
| 11670499 | Method of forming conductive feature including cleaning step | Cheng-Wei Chang, Min-Hsiu Hung, Chun-I Tsai, Yi-Ying Liu | 2023-06-06 |
| 11594609 | Liner-free conductive structures | Shuen-Shin Liang, Chun-I Tsai, Chih-Wei Chang, Chun-Hsien Huang, Hung-Yi Huang +4 more | 2023-02-28 |
| 11521929 | Capping layer for liner-free conductive structures | Shuen-Shin Liang, Chun-I Tsai, Chih-Wei Chang, Chun-Hsien Huang, Hung-Yi Huang +4 more | 2022-12-06 |
| 11257712 | Source/drain contact formation methods and devices | Cheng-Wei Chang, Yu-Ming Huang, Ethan Tseng, Yi-Ying Liu | 2022-02-22 |
| 11217524 | Interconnect structure and manufacturing method for the same | Shuen-Shin Liang, Hung-Yi Huang, Chien-Kuo Chang, Chi-Hung Chuang, Kai-Yi Chu +7 more | 2022-01-04 |
| 11195791 | Method for forming semiconductor contact structure | Yu-Wen Cheng, Wei-Yip Loh, Yu-Hsiang Liao, Sheng-Hsuan Lin, Hong-Mao Lee +4 more | 2021-12-07 |
| 11062941 | Contact conductive feature formation and structure | Chun-I Tsai, Ming-Hsing Tsai, Wei-Jung Lin | 2021-07-13 |
| 10971396 | Conductive feature formation and structure | Yu-Shih Wang, Chun-I Tsai, Shian Wei Mao, Ming-Hsing Tsai, Wei-Jung Lin | 2021-04-06 |