Issued Patents All Time
Showing 26–36 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10964590 | Contact metallization process | Tien-Pei Chou, Sheng-Hsuan Lin, Yueh-Ching Pai, Yu-Ting Lin | 2021-03-30 |
| 10580693 | Contact conductive feature formation and structure | Chun-I Tsai, Ming-Hsing Tsai, Wei-Jung Lin | 2020-03-03 |
| 10504832 | Method for manufacturing copper layer | Hung-Wen Su | 2019-12-10 |
| 10504834 | Contact structure and the method of forming the same | Yu-Wen Cheng, Wei-Yip Loh, Yu-Hsiang Liao, Sheng-Hsuan Lin, Hong-Mao Lee +4 more | 2019-12-10 |
| 10361120 | Conductive feature formation and structure | Yu-Shih Wang, Chun-I Tsai, Shian Wei Mao, Ming-Hsing Tsai, Wei-Jung Lin | 2019-07-23 |
| 10332789 | Semiconductor device with TiN adhesion layer for forming a contact plug | Tien-Pei Chou, Chun-Chieh Wang, Yueh-Ching Pai, Yu-Ting Lin, Yu-Wen Cheng | 2019-06-25 |
| 9812397 | Method of forming hybrid diffusion barrier layer and semiconductor device thereof | Kai-Shiang Kuo, Ya-Lien Lee, Hung-Wen Su | 2017-11-07 |
| 9437485 | Method for line stress reduction through dummy shoulder structures | Cheng-Cheng Kuo, Tzu-Chun Lo, Ming-Hsing Tsai, Jye-Yen Cheng, Jeng-Shiun Ho +2 more | 2016-09-06 |
| 9240378 | Method of forming a copper layer using physical vapor deposition | Hung-Wen Su | 2016-01-19 |
| 8962473 | Method of forming hybrid diffusion barrier layer and semiconductor device thereof | Kai-Shiang Kuo, Ya-Lien Lee, Hung-Wen Su | 2015-02-24 |
| 8692351 | Dummy shoulder structure for line stress reduction | Cheng-Cheng Kuo, Luke Lo, Minghsing Tsai, Jye-Yen Cheng, Jeng-Shiun Ho +2 more | 2014-04-08 |