Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12191199 | Contact metallization process | Ken-Yu Chang, Sheng-Hsuan Lin, Yueh-Ching Pai, Yu-Ting Lin | 2025-01-07 |
| 10964590 | Contact metallization process | Ken-Yu Chang, Sheng-Hsuan Lin, Yueh-Ching Pai, Yu-Ting Lin | 2021-03-30 |
| 10332789 | Semiconductor device with TiN adhesion layer for forming a contact plug | Ken-Yu Chang, Chun-Chieh Wang, Yueh-Ching Pai, Yu-Ting Lin, Yu-Wen Cheng | 2019-06-25 |