Issued Patents All Time
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400853 | Method of forming conductive feature including cleaning step | Cheng-Wei Chang, Min-Hsiu Hung, Ken-Yu Chang, Yi-Ying Liu | 2025-08-26 |
| 12327788 | Gate to source drain interconnects | Shuen-Shin Liang, Chia-Hung Chu, Po-Chin Chang, Tzu-Pei Chen, Ken-Yu Chang +6 more | 2025-06-10 |
| 12148659 | Contact conductive feature formation and structure | Ken-Yu Chang, Ming-Hsing Tsai, Wei-Jung Lin | 2024-11-19 |
| 12057397 | Capping layer for liner-free conductive structures | Shuen-Shin Liang, Chih-Wei Chang, Chun-Hsien Huang, Hung-Yi Huang, Keng-Chu Lin +4 more | 2024-08-06 |
| 12020981 | Conductive feature formation and structure | Yu-Shih Wang, Shian Wei Mao, Ken-Yu Chang, Ming-Hsing Tsai, Wei-Jung Lin | 2024-06-25 |
| 11955329 | Method of forming conductive feature including cleaning step | Cheng-Wei Chang, Min-Hsiu Hung, Ken-Yu Chang, Yi-Ying Liu | 2024-04-09 |
| 11955379 | Metal adhesion layer to promote metal plug adhesion | Pei-Wen Wu, Chi-Cheng Hung, Jyh-Cherng Sheu, Yu-Sheng Wang, Ming-Hsing Tsai | 2024-04-09 |
| 11929314 | Interconnect structures including a fin structure and a metal cap | Chun-Hsien Huang, Peng-Fu Hsu, Yu-Syuan Cai, Min-Hsiu Hung, Chen-Yuan Kao +4 more | 2024-03-12 |
| 11817384 | Interconnect structure and manufacturing method for the same | Shuen-Shin Liang, Ken-Yu Chang, Hung-Yi Huang, Chien-Kuo Chang, Chi-Hung Chuang +7 more | 2023-11-14 |
| 11798843 | Conductive feature formation and structure | Yu-Shih Wang, Shian Wei Mao, Ken-Yu Chang, Ming-Hsing Tsai, Wei-Jung Lin | 2023-10-24 |
| 11676859 | Contact conductive feature formation and structure | Ken-Yu Chang, Ming-Hsing Tsai, Wei-Jung Lin | 2023-06-13 |
| 11670499 | Method of forming conductive feature including cleaning step | Cheng-Wei Chang, Min-Hsiu Hung, Ken-Yu Chang, Yi-Ying Liu | 2023-06-06 |
| 11594609 | Liner-free conductive structures | Shuen-Shin Liang, Chih-Wei Chang, Chun-Hsien Huang, Hung-Yi Huang, Keng-Chu Lin +4 more | 2023-02-28 |
| 11521929 | Capping layer for liner-free conductive structures | Shuen-Shin Liang, Chih-Wei Chang, Chun-Hsien Huang, Hung-Yi Huang, Keng-Chu Lin +4 more | 2022-12-06 |
| 11217524 | Interconnect structure and manufacturing method for the same | Shuen-Shin Liang, Ken-Yu Chang, Hung-Yi Huang, Chien-Kuo Chang, Chi-Hung Chuang +7 more | 2022-01-04 |
| 11195791 | Method for forming semiconductor contact structure | Yu-Wen Cheng, Wei-Yip Loh, Yu-Hsiang Liao, Sheng-Hsuan Lin, Hong-Mao Lee +4 more | 2021-12-07 |
| 11062941 | Contact conductive feature formation and structure | Ken-Yu Chang, Ming-Hsing Tsai, Wei-Jung Lin | 2021-07-13 |
| 10971396 | Conductive feature formation and structure | Yu-Shih Wang, Shian Wei Mao, Ken-Yu Chang, Ming-Hsing Tsai, Wei-Jung Lin | 2021-04-06 |
| 10580693 | Contact conductive feature formation and structure | Ken-Yu Chang, Ming-Hsing Tsai, Wei-Jung Lin | 2020-03-03 |
| 10504834 | Contact structure and the method of forming the same | Yu-Wen Cheng, Wei-Yip Loh, Yu-Hsiang Liao, Sheng-Hsuan Lin, Hong-Mao Lee +4 more | 2019-12-10 |
| 10361120 | Conductive feature formation and structure | Yu-Shih Wang, Shian Wei Mao, Ken-Yu Chang, Ming-Hsing Tsai, Wei-Jung Lin | 2019-07-23 |
| 10283359 | Systems and methods for gap filling improvement | Chi-Yuan Chen, Li-Ting Wang, Teng-Chun Tsai, Wei-Jung Lin, Huang-Yi Huang +2 more | 2019-05-07 |
| 9978583 | Opening fill process and structures formed thereby | Chi-Yuan Chen, Wei-Jung Lin, Chia-Han Lai | 2018-05-22 |
| 9624576 | Systems and methods for gap filling improvement | Chi-Yuan Chen, Li-Ting Wang, Teng-Chun Tsai, Wei-Jung Lin, Huang-Yi Huang +2 more | 2017-04-18 |
| 9627313 | Opening fill process and structure formed thereby | Chi-Yuan Chen, Wei-Jung Lin, Chia-Han Lai | 2017-04-18 |