Issued Patents All Time
Showing 26–27 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9245797 | Opening fill process and structure formed thereby | Chi-Yuan Chen, Wei-Jung Lin, Chia-Han Lai | 2016-01-26 |
| 9219009 | Method of integrated circuit fabrication | Chia-Han Lai, Wei-Jung Lin | 2015-12-22 |