Issued Patents All Time
Showing 1–25 of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368129 | Temperature controllable bonder equipment for substrate bonding | Han-De Chen, Yun Chen Teng, Chen-Fong Tsai, Huicheng Chang, Yee-Chia Yeo | 2025-07-22 |
| 12362187 | Semiconductor device having a uniform and thin silicide layer on an epitaxial source/drain structure | Kai-Hsuan Lee, Sung-Li Wang, Cheng-Yu Yang, Sheng-Chen Wang, Sai-Hooi Yeong | 2025-07-15 |
| 12347696 | Laser de-bonding carriers and composite carriers thereof | Huicheng Chang, Chen-Fong Tsai, Yun Chen Teng, Han-De Chen, Yee-Chia Yeo | 2025-07-01 |
| 12327811 | Ion implantation with annealing for substrate cutting | Huicheng Chang, Chen-Fong Tsai, Yun Chen Teng, Han-De Chen, Yee-Chia Yeo | 2025-06-10 |
| 12255171 | Wafer bonding system and method of using the same | Han-De Chen, Yun Chen Teng, Chen-Fong Tsai, Huicheng Chang, Yee-Chia Yeo | 2025-03-18 |
| 12249592 | Dynamic bonding gap control and tool for wafer bonding | Han-De Chen, Cheng-I Chu, Yun Chen Teng, Chen-Fong Tsai, Huicheng Chang +1 more | 2025-03-11 |
| 12237211 | Bonding system with sealing gasket and method for using the same | Chieh Chang, Chen-Fong Tsai, Yun Chen Teng, Han-De Chen, Huicheng Chang +1 more | 2025-02-25 |
| 12230532 | Semiconductor device, method of manufacture by monitoring relative humidity, and system of manufacture thereof | Yun Chen Teng, Chen-Fong Tsai, Han-De Chen, Huicheng Chang, Yee-Chia Yeo | 2025-02-18 |
| 12211820 | Wafer bonding apparatus and method | Cheng-I Chu, Han-De Chen, Chen-Fong Tsai, Huicheng Chang, Yee-Chia Yeo | 2025-01-28 |
| 12165888 | Method and system for bonding | Chieh Chang, Huicheng Chang, Yee-Chia Yeo | 2024-12-10 |
| 11990404 | Heat dissipation for semiconductor devices and methods of manufacture | Chen-Fong Tsai, Cheng-I Chu, Huicheng Chang, Yee-Chia Yeo | 2024-05-21 |
| 11955379 | Metal adhesion layer to promote metal plug adhesion | Pei-Wen Wu, Chun-I Tsai, Chi-Cheng Hung, Yu-Sheng Wang, Ming-Hsing Tsai | 2024-04-09 |
| 11908708 | Laser de-bonding carriers and composite carriers thereof | Huicheng Chang, Chen-Fong Tsai, Yun Chen Teng, Han-De Chen, Yee-Chia Yeo | 2024-02-20 |
| 11894438 | Semiconductor device and manufacturing method thereof | Yee-Chia Yeo, Sung-Li Wang, Chi On Chui, Hung-Li Chiang, I-Sheng Chen | 2024-02-06 |
| 11855040 | Ion implantation with annealing for substrate cutting | Huicheng Chang, Chen-Fong Tsai, Yun Chen Teng, Han-De Chen, Yee-Chia Yeo | 2023-12-26 |
| 11450661 | Forming STI regions to separate semiconductor Fins | Chih-Yu Hsu, Yi-Tang Lin, Clement Hsingjen Wann, Chih-Sheng Chang, Wei-Chun Tsai +1 more | 2022-09-20 |
| 11043570 | Semiconductor device and manufacturing method thereof | Yee-Chia Yeo, Sung-Li Wang, Chi On Chui, Hung-Li Chiang, I-Sheng Chen | 2021-06-22 |
| 10879075 | Wrap-around contact plug and method manufacturing same | Sung-Li Wang, Huang-Yi Huang, Chih-Wei Chang, Chi On Chui | 2020-12-29 |
| 10811262 | Semiconductor device having a uniform and thin silicide layer on an epitaxial source/ drain structure and manufacturing method thereof | Kai-Hsuan Lee, Sung-Li Wang, Cheng-Yu Yang, Sheng-Chen Wang, Sai-Hooi Yeong | 2020-10-20 |
| 10658234 | Formation method of interconnection structure of semiconductor device | Min-Hsiu Hung, Sung-Li Wang, Pei-Wen Wu, Yida Li, Chih-Wei Chang +4 more | 2020-05-19 |
| 10636664 | Wrap-around contact plug and method manufacturing same | Sung-Li Wang, Huang-Yi Huang, Chih-Wei Chang, Chi On Chui | 2020-04-28 |
| 10593775 | Semiconductor device and manufacturing method thereof | Yee-Chia Yeo, Sung-Li Wang, Chi On Chui, Hung-Li Chiang, I-Sheng Chen | 2020-03-17 |
| 10475654 | Wrap-around contact plug and method manufacturing same | Sung-Li Wang, Huang-Yi Huang, Chih-Wei Chang, Chi On Chui | 2019-11-12 |
| 10468260 | Wrap-around contact plug and method manufacturing same | Sung-Li Wang, Huang-Yi Huang, Chih-Wei Chang, Chi On Chui | 2019-11-05 |
| 10312369 | Semiconductor Fin FET device with epitaxial source/drain | Hung-Li Chiang, Cheng-Yi Peng, Yee-Chia Yeo | 2019-06-04 |