Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11742276 | Semiconductor package and manufacturing process thereof | Li-Huan Chu, Liang-Chen Lin, Tsung-Yang Hsieh, Hsin-Hsien Lee, Kuen-Hong Tsai | 2023-08-29 |
| 11315860 | Semiconductor package and manufacturing process thereof | Li-Huan Chu, Liang-Chen Lin, Tsung-Yang Hsieh, Hsin-Hsien Lee, Kuen-Hong Tsai | 2022-04-26 |
| 10535593 | Package structure having a plurality of conductive balls with narrow width for ball waist | Pi-Lan Chang, Chen-Shien Chen, Chin-Yu Ku, Wei-Chih Huang, Chun-Ying Lin +1 more | 2020-01-14 |
| 10276481 | Package structure having a plurality of conductive balls having narrow width for the ball waist | Pi-Lan Chang, Chen-Shien Chen, Chin-Yu Ku, Wei-Chih Huang, Chun-Ying Lin +1 more | 2019-04-30 |
| 10037973 | Method for manufacturing semiconductor package structure | Hua-Wei Tseng, Shang-Yun Tu, Hao-Juin Liu, Chen-Shien Chen, Ming Hung Tseng +1 more | 2018-07-31 |
| 9576821 | Package structures including a capacitor and methods of forming the same | Sut-I Lo, Ching-Wen Hsiao, Chen-Shien Chen | 2017-02-21 |
| 9490167 | Pop structures and methods of forming the same | Chih-Hua Chen, En-Hsiang Yeh, Monsen Liu, Chen-Shien Chen | 2016-11-08 |
| 9478474 | Methods and apparatus for forming package-on-packages | Chih-Hua Chen, En-Hsiang Yeh, Monsen Liu, Chen-Shien Chen | 2016-10-25 |
| 9406629 | Semiconductor package structure and manufacturing method thereof | Hua-Wei Tseng, Shang-Yun Tu, Hao-Juin Liu, Chen-Shien Chen, Ming Hung Tseng +1 more | 2016-08-02 |
| 8975726 | POP structures and methods of forming the same | Chih-Hua Chen, En-Hsiang Yeh, Monsen Liu, Chen-Shien Chen | 2015-03-10 |
| 8653626 | Package structures including a capacitor and methods of forming the same | Sut-I Lo, Ching-Wen Hsiao, Chen-Shien Chen | 2014-02-18 |