Issued Patents All Time
Showing 1–25 of 54 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431415 | Buffer block structures for C4 bonding and methods of using the same | Li-Ling Liao, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2025-09-30 |
| 12424511 | High efficiency heat dissipation using discrete thermal interface material films | Yu-Chen Lee, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2025-09-23 |
| 12417970 | Method for forming chip package structure | Chin-Hua Wang, Shu-Shen Yeh, Po-Chen Lai, Po-Yao Lin, Shin-Puu Jeng | 2025-09-16 |
| 12394698 | Underfill cushion films for packaging substrates and methods of forming the same | Ming-Chih Yew, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2025-08-19 |
| 12368114 | Semiconductor device package having warpage control and method of forming the same | Shu-Shen Yeh, Che-Chia Yang, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2025-07-22 |
| 12347758 | Dual-underfill encapsulation for packaging and methods of forming the same | Jing-Ye Juang, Ming-Chih Yew, Hsien-Wei Chen, Shin-Puu Jeng | 2025-07-01 |
| 12347764 | Organic interposer including intra-die structural reinforcement structures and methods of forming the same | Li-Ling Liao, Ming-Chih Yew, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2025-07-01 |
| 12341091 | Semiconductor packages having conductive patterns of redistribution structure having ellipse-like shape | Ming-Chih Yew, Po-Chen Lai, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2025-06-24 |
| 12322703 | Eccentric via structures for stress reduction | Shu-Shen Yeh, Che-Chia Yang, Po-Yao Lin, Shin-Puu Jeng, Chia-Hsiang Lin | 2025-06-03 |
| 12322666 | Package assembly lid and methods for forming the same | Yu-Sheng Lin, Shu-Shen Yeh, Chien-Shen Chen, Po-Yao Lin, Shin-Puu Jeng +3 more | 2025-06-03 |
| 12315768 | Package assembly including lid with additional stress mitigating feet and methods of making the same | Yu-Sheng Lin, Shu-Shen Yeh, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng +3 more | 2025-05-27 |
| 12300568 | High efficiency heat dissipation using discrete thermal interface material films | Yu-Chen Lee, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2025-05-13 |
| 12249568 | Metallization structure | Ming-Chih Yew, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2025-03-11 |
| 12237277 | Package structure and methods of manufacturing the same | Shu-Shen Yeh, Po-Yao Lin, Chin-Hua Wang, Shin-Puu Jeng | 2025-02-25 |
| 12170238 | Semiconductor die package with multi-lid structures and method for forming the same | Shu-Shen Yeh, Che-Chia Yang, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2024-12-17 |
| 12154888 | Semiconductor package and method of manufacturing the same | Feng-Cheng Hsu, Ming-Chih Yew, Po-Yao Lin, Shuo-Mao Chen, Shin-Puu Jeng | 2024-11-26 |
| 12154896 | Three-dimensional integrated circuit packages and methods of forming the same | Chin-Hua Wang, Yu-Sheng Lin, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2024-11-26 |
| 12148684 | Package structure and method | Shu-Shen Yeh, Che-Chia Yang, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2024-11-19 |
| 12132021 | Method for fabricating semiconductor package | Ming-Chih Yew, Po-Hao Tsai, Po-Yao Lin, Shin-Puu Jeng | 2024-10-29 |
| 12113033 | Chip package structure | Po-Chen Lai, Chin-Hua Wang, Ming-Chih Yew, Li-Ling Liao, Po-Yao Lin +1 more | 2024-10-08 |
| 12100664 | Semiconductor device with curved conductive lines and method of forming the same | Ming-Chih Yew, Shu-Shen Yeh, Che-Chia Yang, Po-Yao Lin, Shin-Puu Jeng | 2024-09-24 |
| 12094828 | Eccentric via structures for stress reduction | Shu-Shen Yeh, Che-Chia Yang, Po-Yao Lin, Shin-Puu Jeng, Chia-Hsiang Lin | 2024-09-17 |
| 12094810 | Reinforcing package using reinforcing patches | Ming-Chih Yew, Po-Yao Lin, Shuo-Mao Chen, Feng-Cheng Hsu, Shin-Puu Jeng | 2024-09-17 |
| 12068260 | Semiconductor die package with ring structure and method for forming the same | Yu-Chen Lee, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2024-08-20 |
| 12040267 | Organic interposer including intra-die structural reinforcement structures and methods of forming the same | Li-Ling Liao, Ming-Chih Yew, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2024-07-16 |