Issued Patents All Time
Showing 26–50 of 54 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12035475 | Semiconductor package with stress reduction design and method for forming the same | Ming-Chih Yew, Po-Chen Lai, Po-Yao Lin, Shin-Puu Jeng | 2024-07-09 |
| 12033947 | Semiconductor package structure and method for forming the same | Ming-Chih Yew, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2024-07-09 |
| 12033928 | Manufacturing method of semiconductor package | Ming-Chih Yew, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2024-07-09 |
| 11973001 | Semiconductor device and method of manufacture | Shu-Shen Yeh, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2024-04-30 |
| 11908757 | Die corner removal for molding compound crack suppression in semiconductor die packaging and methods for forming the same | Ming-Chih Yew, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2024-02-20 |
| 11862549 | Semiconductor packages having conductive patterns of redistribution structure having ellipse-like shape | Ming-Chih Yew, Po-Chen Lai, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2024-01-02 |
| 11855004 | Package structure | Ming-Chih Yew, Shu-Shen Yeh, Che-Chia Yang, Po-Yao Lin, Shin-Puu Jeng | 2023-12-26 |
| 11830800 | Metallization structure and package structure | Ming-Chih Yew, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2023-11-28 |
| 11798897 | Package structure and methods of manufacturing the same | Shu-Shen Yeh, Po-Yao Lin, Chin-Hua Wang, Shin-Puu Jeng | 2023-10-24 |
| 11784148 | Semiconductor package | Ming-Chih Yew, Po-Hao Tsai, Po-Yao Lin, Shin-Puu Jeng | 2023-10-10 |
| 11756873 | Semiconductor package and manufacturing method thereof | Ming-Chih Yew, Tsung-Yen Lee, Po-Yao Lin, Shin-Puu Jeng | 2023-09-12 |
| 11749644 | Semiconductor device with curved conductive lines and method of forming the same | Ming-Chih Yew, Shu-Shen Yeh, Che-Chia Yang, Po-Yao Lin, Shin-Puu Jeng | 2023-09-05 |
| 11728284 | Chip package structure and method for forming the same | Po-Chen Lai, Chin-Hua Wang, Ming-Chih Yew, Li-Ling Liao, Po-Yao Lin +1 more | 2023-08-15 |
| 11728256 | Reinforcing package using reinforcing patches | Ming-Chih Yew, Po-Yao Lin, Shuo-Mao Chen, Feng-Cheng Hsu, Shin-Puu Jeng | 2023-08-15 |
| 11705420 | Multi-bump connection to interconnect structure and manufacturing method thereof | Tsung-Yen Lee, Shang-Lun Tsai, Ming-Chih Yew, Po-Yao Lin | 2023-07-18 |
| 11699668 | Semiconductor device package having warpage control and method of forming the same | Shu-Shen Yeh, Che-Chia Yang, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2023-07-11 |
| 11694941 | Semiconductor die package with multi-lid structures and method for forming the same | Shu-Shen Yeh, Che-Chia Yang, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2023-07-04 |
| 11682602 | Semiconductor device and method of manufacture | Shu-Shen Yeh, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2023-06-20 |
| 11652037 | Semiconductor package and method of manufacture | Ming-Chih Yew, Po-Chen Lai, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2023-05-16 |
| 11610835 | Organic interposer including intra-die structural reinforcement structures and methods of forming the same | Li-Ling Liao, Ming-Chih Yew, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2023-03-21 |
| 11594477 | Semiconductor package and method of manufacturing semiconductor package | Ming-Chih Yew, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2023-02-28 |
| 11393746 | Reinforcing package using reinforcing patches | Ming-Chih Yew, Po-Yao Lin, Shuo-Mao Chen, Feng-Cheng Hsu, Shin-Puu Jeng | 2022-07-19 |
| 11282756 | Organic interposer including stress-resistant bonding structures and methods of forming the same | Tsung-Yen Lee, Chin-Hua Wang, Ming-Chih Yew, Po-Chen Lai, Po-Yao Lin +1 more | 2022-03-22 |
| 11282803 | Device, semiconductor package and method of manufacturing semiconductor package | Ming-Chih Yew, Po-Hao Tsai, Po-Yao Lin, Shin-Puu Jeng | 2022-03-22 |
| 11264359 | Chip bonded to a redistribution structure with curved conductive lines | Ming-Chih Yew, Shu-Shen Yeh, Che-Chia Yang, Po-Yao Lin, Shin-Puu Jeng | 2022-03-01 |