Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406898 | Chip package structure with lid | Shu-Shen Yeh, Yu-Sheng Lin, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2025-09-02 |
| 12387991 | Manufacturing method of semiconductor package | Shu-Shen Yeh, Chin-Hua Wang, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng | 2025-08-12 |
| 12368080 | Chip package structure with ring structure | Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng, Po-Chen Lai, Kuang-Chun Lee +2 more | 2025-07-22 |
| 12368114 | Semiconductor device package having warpage control and method of forming the same | Shu-Shen Yeh, Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2025-07-22 |
| 12322703 | Eccentric via structures for stress reduction | Shu-Shen Yeh, Chia-Kuei Hsu, Po-Yao Lin, Shin-Puu Jeng, Chia-Hsiang Lin | 2025-06-03 |
| 12322704 | Package structure with underfill | Yu-Sheng Lin, Shin-Puu Jeng, Po-Yao Lin, Chin-Hua Wang, Shu-Shen Yeh | 2025-06-03 |
| 12266635 | Semiconductor device package having dummy dies | Shu-Shen Yeh, Po-Chen Lai, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2025-04-01 |
| 12261102 | Semiconductor package and method of forming the same | Li-Ling Liao, Ming-Chih Yew, Po-Chen Lai, Po-Yao Lin, Shin-Puu Jeng | 2025-03-25 |
| 12237276 | Package structure | Po-Chen Lai, Chin-Hua Wang, Ming-Chih Yew, Shu-Shen Yeh, Po-Yao Lin +1 more | 2025-02-25 |
| 12170238 | Semiconductor die package with multi-lid structures and method for forming the same | Shu-Shen Yeh, Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2024-12-17 |
| 12148684 | Package structure and method | Shu-Shen Yeh, Chin-Hua Wang, Chia-Kuei Hsu, Po-Yao Lin, Shin-Puu Jeng | 2024-11-19 |
| 12125822 | Method of manufacturing a semiconductor device package having dummy dies | Shu-Shen Yeh, Po-Chen Lai, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2024-10-22 |
| 12100664 | Semiconductor device with curved conductive lines and method of forming the same | Chia-Kuei Hsu, Ming-Chih Yew, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2024-09-24 |
| 12094828 | Eccentric via structures for stress reduction | Shu-Shen Yeh, Chia-Kuei Hsu, Po-Yao Lin, Shin-Puu Jeng, Chia-Hsiang Lin | 2024-09-17 |
| 12033906 | Semiconductor package and manufacturing method thereof | Shu-Shen Yeh, Chin-Hua Wang, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng | 2024-07-09 |
| 12033913 | Chip package structure with lid and method for forming the same | Shu-Shen Yeh, Yu-Sheng Lin, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2024-07-09 |
| 11990418 | Chip package structure with buffer structure and method for forming the same | Chin-Hua Wang, Po-Chen Lai, Ping-Tai CHEN, Yu-Sheng Lin, Po-Yao Lin +1 more | 2024-05-21 |
| 11978722 | Structure and formation method of package containing chip structure with inclined sidewalls | Shu-Shen Yeh, Po-Chen Lai, Li-Ling Liao, Po-Yao Lin, Shin-Puu Jeng | 2024-05-07 |
| 11855008 | Stacking via structures for stress reduction | Shu-Shen Yeh, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng, Chia-Hsiang Lin | 2023-12-26 |
| 11855004 | Package structure | Chia-Kuei Hsu, Ming-Chih Yew, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2023-12-26 |
| 11784130 | Structure and formation method of package with underfill | Yu-Sheng Lin, Shin-Puu Jeng, Po-Yao Lin, Chin-Hua Wang, Shu-Shen Yeh | 2023-10-10 |
| 11749644 | Semiconductor device with curved conductive lines and method of forming the same | Chia-Kuei Hsu, Ming-Chih Yew, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2023-09-05 |
| 11728233 | Chip package structure with ring structure and method for forming the same | Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng, Po-Chen Lai, Kuang-Chun Lee +2 more | 2023-08-15 |
| 11721643 | Package structure | Po-Chen Lai, Chin-Hua Wang, Ming-Chih Yew, Shu-Shen Yeh, Po-Yao Lin +1 more | 2023-08-08 |
| 11699668 | Semiconductor device package having warpage control and method of forming the same | Shu-Shen Yeh, Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2023-07-11 |