Issued Patents All Time
Showing 26–29 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11694941 | Semiconductor die package with multi-lid structures and method for forming the same | Shu-Shen Yeh, Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2023-07-04 |
| 11670601 | Stacking via structures for stress reduction | Shu-Shen Yeh, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng, Chia-Hsiang Lin | 2023-06-06 |
| 11264359 | Chip bonded to a redistribution structure with curved conductive lines | Chia-Kuei Hsu, Ming-Chih Yew, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2022-03-01 |
| 10790164 | Method for forming package structure | Wen-Yi Lin, Kuang-Chun Lee, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng | 2020-09-29 |