Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11990418 | Chip package structure with buffer structure and method for forming the same | Chin-Hua Wang, Po-Chen Lai, Che-Chia Yang, Yu-Sheng Lin, Po-Yao Lin +1 more | 2024-05-21 |