Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12387945 | Semiconductor structures including glass core layer and methods of forming the same | Hsien-Wei Chen, Shin-Puu Jeng | 2025-08-12 |
| 12347758 | Dual-underfill encapsulation for packaging and methods of forming the same | Chia-Kuei Hsu, Ming-Chih Yew, Hsien-Wei Chen, Shin-Puu Jeng | 2025-07-01 |
| 11715721 | Electrical connecting structure having nano-twins copper | Chih-Yang Chen, Kai-Cheng Shie | 2023-08-01 |
| 11145619 | Electrical connecting structure having nano-twins copper and method of forming the same | Chih-Yang Chen, Kai-Cheng Shie | 2021-10-12 |
| 9184153 | Chip stack structure and method for fabricating the same | Su-Tsai Lu | 2015-11-10 |
| 8384215 | Wafer level molding structure | Su-Tsai Lu, Yu-Min Lin | 2013-02-26 |