Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334465 | Semiconductor package and method of forming same | Li-Hsien Huang, Yao-Chun Chuang, Ching-Pin Lin, Jun He | 2025-06-17 |
| 11984422 | Semiconductor package and method of forming same | Li-Hsien Huang, Yao-Chun Chuang, Ching-Pin Lin, Jun He | 2024-05-14 |