Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12237226 | Dicing method for stacked semiconductor devices | Jun He, Li-Huan Chu, Pei-Haw Tsao | 2025-02-25 |
| 12205859 | Package and printed circuit board attachment | Pei-Haw Tsao, Li-Huan Chu | 2025-01-21 |
| 12051624 | Stacked semiconductor devices and methods of forming thereof | Jun He, Li-Huan Chu, Pei-Haw Tsao | 2024-07-30 |
| 11990423 | Magnetic shielding material with insulator-coated ferromagnetic particles | Pei-Haw Tsao, Li-Huan Chu | 2024-05-21 |
| 11610827 | Package and printed circuit board attachment | Pei-Haw Tsao, Li-Huan Chu | 2023-03-21 |
| 11404383 | Magnetic shielding material with insulator-coated ferromagnetic particles | Pei-Haw Tsao, Li-Huan Chu | 2022-08-02 |
| 11239143 | Semiconductor structure and manufacturing method thereof | Pei-Haw Tsao, Li-Huan Chu | 2022-02-01 |
| 11101190 | Package and printed circuit board attachment | Pei-Haw Tsao, Li-Huan Chu | 2021-08-24 |
| 11081392 | Dicing method for stacked semiconductor devices | Jun He, Li-Huan Chu, Pei-Haw Tsao | 2021-08-03 |
| 10912194 | Printed circuit board | Pei-Haw Tsao, Li-Huan Chu | 2021-02-02 |
| 10892230 | Magnetic shielding material with insulator-coated ferromagnetic particles | Pei-Haw Tsao, Li-Huan Chu | 2021-01-12 |
| 10867881 | Package and printed circuit board attachment | Pei-Haw Tsao, Li-Huan Chu | 2020-12-15 |
| 10510633 | Package and printed circuit board attachment | Pei-Haw Tsao, Li-Huan Chu | 2019-12-17 |
| 10506712 | Printed circuit board | Pei-Haw Tsao, Li-Huan Chu | 2019-12-10 |
| 10373901 | Semiconductor structure and manufacturing method thereof | Pei-Haw Tsao, Li-Huan Chu | 2019-08-06 |
| 10304793 | Package structure and method for forming the same | Pei-Haw Tsao | 2019-05-28 |