Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368120 | Semiconductor device and method | Chen-Shien Chen, Ting-Li Yang, Po-Hao Tsai, Ming-Da Cheng | 2025-07-22 |
| 12327782 | Systems for semiconductor package mounting with improved co-planarity | Wen-Yi Lin, Kuang-Chun Lee, Chen-Shien Chen | 2025-06-10 |
| 12322716 | Heat dissipating features for laser drilling process | Chien-Hung Chen, Cheng-Pu Chiu, Chien-Li Kuo, Ting-Ting Kuo, Li-Hsien Huang +2 more | 2025-06-03 |
| 12183709 | Chip package structure with ring-like structure | Sheng-Yao Yang, Ling Li, Yu-Jui Wu, Cheng-Lin Huang, Lieh-Chuan Chen +2 more | 2024-12-31 |
| 12119276 | Package structure with protective lid | Wen-Yi Lin, Kuang-Chun Lee, Chen-Shien Chen | 2024-10-15 |
| 12019097 | Method for forming probe head structure | Wen-Yi Lin, Hao Chen, Chuan-Hsiang Sun, Mill-Jer Wang, Chen-Shien Chen | 2024-06-25 |
| 11984419 | Package structure with a barrier layer | Cheng-Hung Chen, Yu-Nu Hsu, Chun-Chen Liu, Heng-Chi Huang, Shih-Yen Chen +7 more | 2024-05-14 |
| 11862588 | Semiconductor device and method | Chen-Shien Chen, Ting-Li Yang, Po-Hao Tsai, Ming-Da Cheng | 2024-01-02 |
| 11848302 | Chip package structure with ring-like structure | Sheng-Yao Yang, Ling Li, Yu-Jui Wu, Cheng-Lin Huang, Lieh-Chuan Chen +2 more | 2023-12-19 |
| 11764118 | Structure and formation method of chip package with protective lid | Wen-Yi Lin, Kuang-Chun Lee, Chen-Shien Chen | 2023-09-19 |
| 11545463 | Chip package structure with ring-like structure | Sheng-Yao Yang, Ling Li, Yu-Jui Wu, Cheng-Lin Huang, Lieh-Chuan Chen +2 more | 2023-01-03 |
| 11469203 | Method for forming package structure with a barrier layer | Cheng-Hung Chen, Yu-Nu Hsu, Chun-Chen Liu, Heng-Chi Huang, Shih-Yen Chen +7 more | 2022-10-11 |
| 11088108 | Chip package structure including ring-like structure and method for forming the same | Sheng-Yao Yang, Ling Li, Yu-Jui Wu, Cheng-Lin Huang, Lieh-Chuan Chen +2 more | 2021-08-10 |
| 10811377 | Package structure with a barrier layer and method for forming the same | Cheng-Hung Chen, Yu-Nu Hsu, Chun-Chen Liu, Heng-Chi Huang, Shih-Yen Chen +7 more | 2020-10-20 |
| 10170429 | Method for forming package structure including intermetallic compound | Heng-Chi Huang, Kuo-Lung Li, Cheng-Liang Cho, Che-Jung Chu, Kuo-Chio Liu | 2019-01-01 |
| 10056275 | Immersion de-taping | Ching Tasi Liu, Fu-Chen Chang, Te Lung Liu, Kuo-Liang Lu | 2018-08-21 |
| 10014218 | Method for forming semiconductor device structure with bumps | Meng-Fu Shih, Cheng-Lin Huang, Che-Jung Chu, Wen-Ming Chen, Kuo-Chio Liu | 2018-07-03 |
| 9613845 | Immersion de-taping | Ching Tasi Liu, Fu-Chen Chang, Te Lung Liu, Kuo-Liang Lu | 2017-04-04 |
| 9209048 | Two step molding grinding for packaging applications | Wen-Chun Huang, Kuo-Chio Liu, Ruey-Yun Shiue, Hsi-Kuei Cheng, Chih-Hsien Lin +3 more | 2015-12-08 |
| 7179708 | Process for fabricating non-volatile memory by tilt-angle ion implantation | Erik S. Jeng, Wu Chou, Li-Kang Wu | 2007-02-20 |