Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9209048 | Two step molding grinding for packaging applications | Wen-Chun Huang, Chien-Chen Li, Kuo-Chio Liu, Hsi-Kuei Cheng, Chih-Hsien Lin +3 more | 2015-12-08 |
| 7759797 | Bonding pad structure to minimize IMD cracking | Chung-Shi Liu, Yuan-Lung Liu | 2010-07-20 |
| 7323784 | Top via pattern for bond pad structure | Ho-Yin Yiu, Fu-Jier Fan, Yu-Jui Wu, Aaron Wang, Hsiang-Wei Wang +2 more | 2008-01-29 |
| 7135395 | Bonding pad structure to minimize IMD cracking | Chung Liu, Yuan-Lung Liu | 2006-11-14 |
| 6875682 | Mesh pad structure to eliminate IMD crack on pad | Chung-Shi Liu, Yuan-Lung Liu | 2005-04-05 |
| 6451679 | Ion mixing between two-step titanium deposition process for titanium salicide CMOS technology | Chu-Wei Hu, Jine-Wen Weng | 2002-09-17 |
| 6211069 | Dual damascene process flow for a deep sub-micron technology | Chu-Wei Hu, Jiue-Wen Weng | 2001-04-03 |
| 6140693 | Method for making metal capacitors for deep submicrometer processes for semiconductor integrated circuits | Jiue-Wen Weng | 2000-10-31 |
| 5953601 | ESD implantation scheme for 0.35 .mu.m 3.3V 70A gate oxide process | Chin-Shan Hou, Yi-Hsun Wu, Lin-June Wu | 1999-09-14 |
| 5946567 | Method for making metal capacitors for deep submicrometer processes for semiconductor integrated circuits | Jiue-Wen Weng | 1999-08-31 |
| 5923088 | Bond pad structure for the via plug process | Wen-Teng Wu, Pi-Chen Shieh, Chin-Kai Liu | 1999-07-13 |
| 5781445 | Plasma damage monitor | Sung-Mu Hsu | 1998-07-14 |
| 5700735 | Method of forming bond pad structure for the via plug process | Wen-Teng Wu, Pi-Chen Shieh, Chin-Kai Liu | 1997-12-23 |