Issued Patents All Time
Showing 1–25 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12241179 | High-whiteness polyimide microfiber and preparation method thereof and use | Jingang Liu, Xinxin Zhi, Yan Zhang, Chenyu Guo, Xiao Wu | 2025-03-04 |
| 12183535 | Dielectric coated plasmonic photoemitter | Peng Zhang, Xiao Xiong, Yang Zhou | 2024-12-31 |
| 8691822 | Dihydropteridinone derivatives, preparation process and pharmaceutical use thereof | Peng Cho Tang, Nong Zhang, Baolei Zhang, Weimin Wang, Hao Zheng | 2014-04-08 |
| 8680635 | CMOS image sensor big via bonding pad application for AICu process | Uway Tseng, Yu-Ting Lin | 2014-03-25 |
| 8502335 | CMOS image sensor big via bonding pad application for AlCu Process | Uway Tseng, Yu-Ting Lin | 2013-08-06 |
| 8344471 | CMOS image sensor big via bonding pad application for AICu process | Uway Tseng, Yu-Ting Lin | 2013-01-01 |
| 7220650 | Sidewall spacer for semiconductor device and fabrication method thereof | Rong-Hui Kao, Chang-Sheng Tsao, Yen-Ming Chen | 2007-05-22 |
| 7067896 | Microelectronic fabrication having edge passivated bond pad integrated with option selection device access aperture | Juei-Kuo Wu, Yi-Lang Wu, Dian-Hau Chen | 2006-06-27 |
| 6717220 | Tunable threshold voltage of a thick field oxide ESD protection device with a N-field implant | Tao Cheng, Jyh-Cheng You | 2004-04-06 |
| 6693317 | Optical sensor by using tunneling diode | Ho-Yin Yiu, Chein-Ling Jan, Jen-Pan Wang | 2004-02-17 |
| 6667230 | Passivation and planarization process for flip chip packages | Dian-Hau Chen, Kwang-Ming Lin | 2003-12-23 |
| 6635576 | Method of fabricating borderless contact using graded-stair etch stop layers | Meng-Chang Liu, Kwang-Ming Lin | 2003-10-21 |
| 6611028 | Dynamic substrate-coupled electrostatic discharging protection circuit | Tao Cheng, Jian-Hsing Lee | 2003-08-26 |
| 6582981 | Method of using a tunneling diode in optical sensing devices | Ho-Yin Yiu, Chein-Ling Jan, Jen-Pan Wang | 2003-06-24 |
| 6531382 | Use of a capping layer to reduce particle evolution during sputter pre-clean procedures | Tao Cheng, Wen-Hsin Huang, Jiun-Pyng You, Shih-Tzung Chang, Ming-jei LEE +4 more | 2003-03-11 |
| 6479872 | Dynamic substrate-coupled electrostatic discharging protection circuit | Tao Cheng, Jian-Hsing Lee | 2002-11-12 |
| 6468904 | RPO process for selective CoSix formation | Dian-Hau Chen, Fu-Mei Chiu | 2002-10-22 |
| 6465308 | Tunable threshold voltage of a thick field oxide ESD protection device with a N-field implant | Tao Cheng, Jyh-Cheng You | 2002-10-15 |
| 6362491 | Method of overlay measurement in both X and Y directions for photo stitch process | Jen-Pan Wang | 2002-03-26 |
| 6329717 | Integrated circuit having selectivity deposited silicon oxide spacer layer formed therein | Syun-Ming Jang, Chen-Hua Yu, Lung Chen | 2001-12-11 |
| 6297102 | Method of forming a surface implant region on a ROM cell using a PLDD implant | Jyh-Cheng You | 2001-10-02 |
| 6284557 | Optical sensor by using tunneling diode | Ho-Yin Yiu, Chein-Ling Jan, Jen-Pan Wang | 2001-09-04 |
| 6258706 | Method for fabricating a stress buffered bond pad | Ho-Yin Yiu, Bor-Cheng Chen, J. H. Horng | 2001-07-10 |
| 6251724 | Method to increase the clear ration of capacitor silicon nitride to improve the threshold voltage uniformity | Shu-Mei KU | 2001-06-26 |
| 6194275 | Method to form a mask ROM device with coding after source and drain implantation | Tao Cheng | 2001-02-27 |