Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424567 | Chip package and manufacturing method thereof | Hsin-Yi Chen, Sheng-Hsiang FU, Ching Ting Peng | 2025-09-23 |
| 10157875 | Chip package and method for forming the same | Ying-Nan Wen, Chien-Hung Liu, Wei-Chung Yang | 2018-12-18 |
| 10056419 | Chip package having chip connected to sensing device with redistribution layer in insulator layer | Ying-Nan Wen, Chien-Hung Liu, Wei-Chung Yang | 2018-08-21 |
| 9966358 | Chip package | Ying-Nan Wen, Chien-Hung Liu, Wei-Chung Yang | 2018-05-08 |
| 9935148 | Method for forming chip package having chip connected to sensing device with redistribution layer in insulator layer | Ying-Nan Wen, Chien-Hung Liu, Wei-Chung Yang | 2018-04-03 |
| 9853074 | Chip scale sensing chip package | Chi-Chang Liao, Shih-Yi LEE, Yen-Kang Raw | 2017-12-26 |
| 9831185 | Chip package and fabrication method thereof | Shih-Yi LEE, Ying-Nan Wen, Chien-Hung Liu | 2017-11-28 |
| 9812413 | Chip module and method for forming the same | Ying-Nan Wen, Chien-Hung Liu | 2017-11-07 |
| 9780050 | Method of fabricating chip package with laser | Ying-Nan Wen, Chien-Hung Liu, Shih-Yi LEE | 2017-10-03 |
| 9768067 | Chip package and manufacturing method thereof | Chien-Hung Liu, Ying-Nan Wen, Shih-Yi LEE | 2017-09-19 |
| 9721911 | Chip package and manufacturing method thereof | Ying-Nan Wen, Chien-Hung Liu, Shih-Yi LEE | 2017-08-01 |
| 9640405 | Chip package having a laser stop structure | Ying-Nan Wen, Chien-Hung Liu, Shih-Yi LEE | 2017-05-02 |
| 9543233 | Chip package having a dual through hole redistribution layer structure | Chien-Hung Liu, Ying-Nan Wen, Shih-Yi LEE | 2017-01-10 |
| 9437478 | Chip package and method for forming the same | Yen-Shih Ho, Tsang-Yu Liu, Shu-Ming Chang, Yu-Lung Huang, Chao-Yen Lin +2 more | 2016-09-06 |
| 9406578 | Chip package having extended depression for electrical connection and method of manufacturing the same | Ying-Nan Wen, Chien-Hung Liu | 2016-08-02 |
| 9088206 | Power module and the method of packaging the same | Chien-Hung Liu, Wei-Chung Yang, Bai-Yao Lou | 2015-07-21 |
| 8981497 | Chip package structure and method for forming the same | Chien-Hung Liu, Tsang-Yu Liu, Ying-Nan Wen, Yen-Shih Ho | 2015-03-17 |
| 8791768 | Capacitive coupler packaging structure | Chien-Hung Liu, Ying-Nan Wen, Shih-Yi LEE, Wei-Chung Yang, Bai-Yao Lou +1 more | 2014-07-29 |
| 8643070 | Chip package and method for forming the same | Shu-Ming Chang, Chien-Hui Chen, Yen-Shih Ho, Chien-Hung Liu, Ying-Nan Wen | 2014-02-04 |
| 8614488 | Chip package and method for forming the same | Ying-Nan Wen, Yen-Shih Ho, Shu-Ming Chang, Chien-Hung Liu, Shih-Yi LEE +1 more | 2013-12-24 |
| 7323784 | Top via pattern for bond pad structure | Fu-Jier Fan, Yu-Jui Wu, Aaron Wang, Hsiang-Wei Wang, Huang-Sheng Lin +2 more | 2008-01-29 |
| 6693317 | Optical sensor by using tunneling diode | Chein-Ling Jan, Jen-Pan Wang, Lin-June Wu | 2004-02-17 |
| 6582981 | Method of using a tunneling diode in optical sensing devices | Chein-Ling Jan, Jen-Pan Wang, Lin-June Wu | 2003-06-24 |
| 6284557 | Optical sensor by using tunneling diode | Chein-Ling Jan, Jen-Pan Wang, Lin-June Wu | 2001-09-04 |
| 6274397 | Method to preserve the testing chip for package's quality | Wen-Cheng Chien, Hui-Chen Chu | 2001-08-14 |