Issued Patents All Time
Showing 26–28 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6258706 | Method for fabricating a stress buffered bond pad | Lin-June Wu, Bor-Cheng Chen, J. H. Horng | 2001-07-10 |
| 6180964 | Low leakage wire bond pad structure for integrated circuits | Lin-June Wu, T. Cheng | 2001-01-30 |
| 5942800 | Stress buffered bond pad and method of making | Lin-June Wu, Bor-Cheng Chen, Jan-Her Horng | 1999-08-24 |