Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7105379 | Implementation of protection layer for bond pad protection | Pei-Haw Tsao, Cheng-Chung Chang | 2006-09-12 |
| 5942800 | Stress buffered bond pad and method of making | Ho-Yin Yiu, Lin-June Wu, Bor-Cheng Chen | 1999-08-24 |