JH

J. H. Horng

TSMC: 1 patents #8,466 of 12,232Top 70%
Overall (All Time): #3,587,567 of 4,157,543Top 90%
1
Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6258706 Method for fabricating a stress buffered bond pad Ho-Yin Yiu, Lin-June Wu, Bor-Cheng Chen 2001-07-10