Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424567 | Chip package and manufacturing method thereof | Hsin-Yi Chen, Sheng-Hsiang FU, Ho-Yin Yiu | 2025-09-23 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424567 | Chip package and manufacturing method thereof | Hsin-Yi Chen, Sheng-Hsiang FU, Ho-Yin Yiu | 2025-09-23 |