Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9280151 | Recipe management system and method | Wei Li, Richard Y. Liu, Jing Yin | 2016-03-08 |
| 9275918 | Statistical method for monitoring manufacturing equipment and processing operations | Liwen Lu | 2016-03-01 |
| 9064788 | Statistical method for monitoring manufacturing equipment and processing operations | Liwen Lu | 2015-06-23 |
| 7528478 | Semiconductor devices having post passivation interconnections and a buffer layer | Hsi-Kuei Cheng, Hung-Ju Chien, Hsun-Chang Chan, Chu-Chang Chen, Ying-Lang Wang +2 more | 2009-05-05 |
| 7304728 | Test device and method for laser alignment calibration | Yu-Ku Lin, Shih-Ho Lin, Kei-Wei Chen, Ting-Chun Wang, Ching-Hwan Su +1 more | 2007-12-04 |
| 7199045 | Metal-filled openings for submicron devices and methods of manufacture thereof | Chi-Wen Liu, Jung-Chih Tsao, Ying-Lang Wang, Kei-Wei Chen | 2007-04-03 |
| 7128821 | Electropolishing method for removing particles from wafer surface | Shih-Ho Lin, Chung-Chang Chen, Kei-Wei Chen, Chao-Lung Chen, Po-Jen Shih +2 more | 2006-10-31 |
| 7071100 | Method of forming barrier layer with reduced resistivity and improved reliability in copper damascene process | Kei-Wei Chen, Jung-Chih Tsao, Chi-Wen Liu, Jchung-Chang Chen, Shih-Ho Lin +2 more | 2006-07-04 |
| 7026233 | Method for reducing defects in post passivation interconnect process | Hsi-Kuei Cheng, Hung-Ju Chien, Hsun-Chang Chan, Chu-Chang Chen, Ying-Lang Wang +2 more | 2006-04-11 |
| 6828226 | Removal of SiON residue after CMP | Kei-Wei Chen, Kuo-Hsiu Wei, Yu-Kin Lin, Ting-Chun Wang, Ying-Lang Wang | 2004-12-07 |
| 6769959 | Method and system for slurry usage reduction in chemical mechanical polishing | Kei-Wei Chen, Ting-Chun Wang, Yu-Ku Lin, Ying-Lang Wang, Ming-Wen Chen +1 more | 2004-08-03 |
| 6626741 | Method for improving thickness uniformity on a semiconductor wafer during chemical mechanical polishing | Ting-Chun Wang, Kei-Wei Chen, Yu-Ku Lin, Ying-Lang Wang | 2003-09-30 |
| 6531382 | Use of a capping layer to reduce particle evolution during sputter pre-clean procedures | Tao Cheng, Wen-Hsin Huang, Jiun-Pyng You, Lin-June Wu, Ming-jei LEE +4 more | 2003-03-11 |
| 6174454 | Slurry formulation for selective CMP of organic spin-on-glass insulating layer with low dielectric constant | Ming-Shih Tsai, Bau-Tong Dai, Ying-Lang Wang | 2001-01-16 |