Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12068195 | Metal loss prevention using implantation | Li-Chieh Wu, Tang-Kuei Chang, Kei-Wei Chen, Ying-Lang Wang, Su-Hao Liu +5 more | 2024-08-20 |
| 11728172 | Wafer thinning apparatus having feedback control | Yuan-Hsuan Chen, Kei-Wei Chen, Ying-Lang Wang | 2023-08-15 |
| 11710659 | Metal loss prevention using implantation | Li-Chieh Wu, Tang-Kuei Chang, Kei-Wei Chen, Ying-Lang Wang, Su-Hao Liu +5 more | 2023-07-25 |
| 11532514 | Structure and formation method of semiconductor device with conductive feature | Li-Chieh Wu, Kei-Wei Chen, Tang-Kuei Chang, Chia Hsuan Lee, Jian-Ci Lin | 2022-12-20 |
| 11482450 | Methods of forming an abrasive slurry and methods for chemical- mechanical polishing | Chia Hsuan Lee, Chun-Wei Hsu, Chia-Wei Ho, Chi-Hsiang Shen, Li-Chieh Wu +6 more | 2022-10-25 |
| 11211289 | Metal loss prevention using implantation | Li-Chieh Wu, Tang-Kuei Chang, Kei-Wei Chen, Ying-Lang Wang, Su-Hao Liu +5 more | 2021-12-28 |
| 10957587 | Structure and formation method of semiconductor device with conductive feature | Li-Chieh Wu, Kei-Wei Chen, Tang-Kuei Chang, Chia Hsuan Lee, Jian-Ci Lin | 2021-03-23 |
| 10937691 | Methods of forming an abrasive slurry and methods for chemical-mechanical polishing | Chia Hsuan Lee, Chun-Wei Hsu, Chia-Wei Ho, Chi-Hsiang Shen, Li-Chieh Wu +6 more | 2021-03-02 |
| 10643853 | Wafer thinning apparatus having feedback control and method of using | Yuan-Hsuan Chen, Kei-Wei Chen, Ying-Lang Wang | 2020-05-05 |
| 10643892 | Metal loss prevention using implantation | Li-Chieh Wu, Tang-Kuei Chang, Kei-Wei Chen, Ying-Lang Wang, Su-Hao Liu +5 more | 2020-05-05 |
| 9931726 | Wafer edge trimming tool using abrasive tape | Tang-Kuei Chang, Kei-Wei Chen, Huai-Tei Yang, Ying-Lang Wang | 2018-04-03 |
| 9829806 | Lithography tool with backside polisher | Tang-Kuei Chang, Kei-Wei Chen, Huai-Tei Yang, Ying-Lang Wang | 2017-11-28 |
| 9721984 | Image sensor manufacturing methods | Mu-Han Cheng, Kei-Wei Chen, Ying-Lang Wang | 2017-08-01 |
| 9676114 | Wafer edge trim blade with slots | Chun-Ting Kuo, Kei-Wei Chen, Ying-Lang Wang | 2017-06-13 |
| 9566683 | Method for wafer grinding | Kei-Wei Chen, Ying-Lang Wang, Chun-Ting Kuo | 2017-02-14 |
| 9570311 | Modular grinding apparatuses and methods for wafer thinning | Chun-Ting Kuo, Kei-Wei Chen, Ying-Lang Wang | 2017-02-14 |
| 9339912 | Wafer polishing tool using abrasive tape | Tang-Kuei Chang, Kei-Wei Chen, Wei-Jen Lo, Ying-Lang Wang | 2016-05-17 |
| 9120194 | Apparatus for wafer grinding | Kei-Wei Chen, Ying-Lang Wang, Chun-Ting Kuo | 2015-09-01 |
| 9064770 | Methods for minimizing edge peeling in the manufacturing of BSI chips | Chun-Ting Kuo, Kei-Wei Chen, Ying-Lang Wang | 2015-06-23 |
| 8049213 | Feature dimension measurement | Ching-Chung Su, Yi-Wei Chiu, Tzu-Chan Weng, Yih-Song Chiu, Pin Chia Su +1 more | 2011-11-01 |
| 6828226 | Removal of SiON residue after CMP | Kei-Wei Chen, Yu-Kin Lin, Ting-Chun Wang, Ying-Lang Wang, Shih-Tzung Chang | 2004-12-07 |
| 6769959 | Method and system for slurry usage reduction in chemical mechanical polishing | Kei-Wei Chen, Ting-Chun Wang, Shih-Tzung Chang, Yu-Ku Lin, Ying-Lang Wang +1 more | 2004-08-03 |