Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300664 | Edge-trimming methods for wafer bonding and dicing | Feng-Chien Hsieh, Yun-Wei Cheng, Kuo-Cheng Lee, Hsin-Chi Chen | 2025-05-13 |
| 11955444 | Semiconductor structure and manufacturing method thereof | Manikandan ARUMUGAM, Tsung-Yi Yang, Chien-Chih Chen, Kuo-Hsien Cheng | 2024-04-09 |
| 11482506 | Edge-trimming methods for wafer bonding and dicing | Feng-Chien Hsieh, Hsin-Chi Chen, Kuo-Cheng Lee, Yun-Wei Cheng | 2022-10-25 |
| 10872873 | Method for bonding wafers and bonding tool | Chien-Chih Chen, Tsung-Yi Yang, Chung-I Hung, Tzu-Shin Chen, Su-Yu Yeh | 2020-12-22 |
| 10792783 | System, control method and apparatus for chemical mechanical polishing | Hsiang-Chu Hu, Chun-Hai Huang, Yu-Chin Tseng, Chien-Chih Chen, Tzu-Shin Chen | 2020-10-06 |
| 10050159 | Lens structure | Chien-Chih Chen, Su-Yu Yeh, Tzu-Shin Chen, Chun-Hai Huang | 2018-08-14 |
| 9721984 | Image sensor manufacturing methods | Kuo-Hsiu Wei, Kei-Wei Chen, Ying-Lang Wang | 2017-08-01 |
| 7837841 | Apparatuses for electrochemical deposition, conductive layer, and fabrication methods thereof | Kei-Wei Chen, Jian-Sin Tsai, Ying-Lang Wang | 2010-11-23 |