Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872873 | Method for bonding wafers and bonding tool | Chien-Chih Chen, Tsung-Yi Yang, Mu-Han Cheng, Tzu-Shin Chen, Su-Yu Yeh | 2020-12-22 |
| 6644078 | Lock furnished with a replaceable lock core | — | 2003-11-11 |
| 6584819 | Lock with two layers of lock mechanism | — | 2003-07-01 |