Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12113120 | Gate electrode having a work-function layer including materials with different average grain sizes | Ru-Shang Hsiao, Ching-Hwanq Su, Ying Hsin Lu, Ling-Sung Wang | 2024-10-08 |
| 12021130 | Circuit structure with gate configuration | Ru-Shang Hsiao, Ying Hsin Lu, Ching-Hwanq Su, Ling-Sung Wang | 2024-06-25 |
| 11949000 | Metal gate structures and methods of fabricating the same in field-effect transistors | Ru-Shang Hsiao, Ching-Hwanq Su, Ying Hsin Lu, I-Shan Huang | 2024-04-02 |
| 11588038 | Circuit structure with gate configuration | Ru-Shang Hsiao, Ying Hsin Lu, Ching-Hwanq Su, Ling-Sung Wang | 2023-02-21 |
| 11502185 | Methods of manufacturing a gate electrode having metal layers with different average grain sizes | Ru-Shang Hsiao, Ching-Hwanq Su, Ying Hsin Lu, Ling-Sung Wang | 2022-11-15 |
| 11476351 | Metal gate structures and methods of fabricating the same in field-effect transistors | Ru-Shang Hsiao, Ching-Hwanq Su, Ying Hsin Lu, I-Shan Huang | 2022-10-18 |
| 9450014 | Backside illumination image sensor chips and methods for forming the same | I-I Cheng, Chih-Mu Huang, Chi-Cherng Jeng, Volume Chien, Chih-Kang Chao | 2016-09-20 |
| 9240503 | Methods of manufacturing and using a photodiode with concave reflector | Che-Min Lin, Volume Chien, Chih-Kang Chao, Chi-Cherng Jeng, Chih-Mu Huang | 2016-01-19 |
| 9142588 | Backside illumination image sensor chips and methods for forming the same | I-I Cheng, Chih-Mu Huang, Chi-Cherng Jeng, Volume Chien, Chih-Kang Chao | 2015-09-22 |
| 8884390 | Backside illumination image sensor chips and methods for forming the same | I-I Cheng, Chih-Kang Chao, Volume Chien, Chi-Cherng Jeng, Chih-Mu Huang | 2014-11-11 |
| 8816415 | Photodiode with concave reflector | Che-Min Lin, Volume Chien, Chih-Kang Chao, Chi-Cherng Jeng, Chih-Mu Huang | 2014-08-26 |
| 8696930 | Silicon wafer reclamation process | Tai-Yung Yu, Yu-Sheng Su, Li-Te Hsu, Jin-Lin Liang | 2014-04-15 |
| 8416555 | System for securely dechucking wafers | Chung-Tsung Lu, Yu-Chih Liou | 2013-04-09 |
| 8049213 | Feature dimension measurement | Ching-Chung Su, Yi-Wei Chiu, Tzu-Chan Weng, Yih-Song Chiu, Chih-Cherng Jeng +1 more | 2011-11-01 |
| 8000081 | Method and apparatus for safely dechucking wafers | Chung-Tsung Lu, Yu-Chih Liou | 2011-08-16 |
| 7995323 | Method and apparatus for securely dechucking wafers | Chung-Tsung Lu, Yu-Chih Liou | 2011-08-09 |
| 7973293 | Implantation quality improvement by xenon/hydrogen dilution gas | Yu LIN, Wei-Ming You, Ruey-Yong Deng, Jiunn-Nan Lin, Sheng-Chien Tung | 2011-07-05 |
| 7910014 | Method and system for improving wet chemical bath process stability and productivity in semiconductor manufacturing | Tai-Yung Yu, Yu-Sheng Su, Li-Te Hsu, Jin-Lin Liang, Shih-Cheng Yeh | 2011-03-22 |
| 7851374 | Silicon wafer reclamation process | Tai-Yung Yu, Yu-Sheng Su, Li-Te Hsu, Jin-Lin Liang | 2010-12-14 |
| 7588946 | Controlling system for gate formation of semiconductor devices | Chia-Tsung Tso, Jiun-Hong Lai, Mei-Jen Wu, Li-Te Hsu, Po-Zen Chen | 2009-09-15 |
| 7306746 | Critical dimension control in a semiconductor fabrication process | Fang Chen, Li-Te Hsu, I Cheng Tseng, Hsu Chiung Wen, Tsung-Chuan Chen | 2007-12-11 |
| 7101748 | Method of integrating the formation of a shallow junction N channel device with the formation of P channel, ESD and input/output devices | Yu-Lung Yeh, Chu-We Hu, Li-Te Hsu | 2006-09-05 |
| 7018928 | Plasma treatment method to reduce silicon erosion over HDI silicon regions | Li-Te Hsu, Chia-Lun Chen, Chiang-Jen Peng | 2006-03-28 |
| 6808589 | Wafer transfer robot having wafer blades equipped with sensors | Yu-Sheng Su, Chiang-Jen Peng, WEN-LANG WU | 2004-10-26 |
| 6777334 | Method for protecting a wafer backside from etching damage | Le Der Shiu, Yin-Shen Chu | 2004-08-17 |