Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12261188 | Image sensor device and methods of forming the same | Keng-Ying Liao, Yu-Chu Lin, Chih-Wei Sung, Shih Sian Wang, Chi-Chung Jen +3 more | 2025-03-25 |
| 12191338 | Image sensor device and methods of forming the same | Keng-Ying Liao, Huai-Jen Tung, Chih-Wei Sung, Yu-Chien Ku, Yu-Chu Lin +3 more | 2025-01-07 |
| 12183550 | Wafer treatment system and method of treating wafer | Po-Hsun Chen, Chun-Wei Chou, Keng-Ying Liao, Tzu-Pin Lin, Tai-Chin Wu +1 more | 2024-12-31 |
| 12094997 | BSI chip with backside alignment mark | Chih-Wei Sung, Chung-Bin Tseng, Keng-Ying Liao, Yen-Jou Wu, Su-Yu Yeh +1 more | 2024-09-17 |
| 11652133 | Image sensor grid and method of manufacturing same | H. L. Chen, Huai-Jen Tung, Keng-Ying Liao, Su-Yu Yeh, Chih-Wei Sung | 2023-05-16 |
| 11652127 | Image sensor device and methods of forming the same | Keng-Ying Liao, Huai-Jen Tung, Chih-Wei Sung, Yu-Chien Ku, Yu-Chu Lin +3 more | 2023-05-16 |
| 11532658 | Image sensor grid and method of fabrication of same | Chin-Yu Lin, Keng-Ying Liao, Su-Yu Yeh, Huai-Jen Tung, Hsien-Li CHEN | 2022-12-20 |
| 11502123 | Methods for forming image sensor devices | Keng-Ying Liao, Huai-Jen Tung, Chih-Wei Sung, Yu-Chien Ku, Yu-Chu Lin +4 more | 2022-11-15 |
| 11430909 | BSI chip with backside alignment mark | Chih-Wei Sung, Chung-Bin Tseng, Keng-Ying Liao, Yen-Jou Wu, Su-Yu Yeh +1 more | 2022-08-30 |
| 11164903 | Image sensor with pad structure | Huai-Jen Tung, Ching-Chung Su, Keng-Ying Liao, Su-Yu Yeh, S. Y. Chen | 2021-11-02 |
| 11069740 | Image sensor grid and method of manufacturing same | H. L. Chen, Huai-Jen Tung, Keng-Ying Liao, Su-Yu Yeh, Chih-Wei Sung | 2021-07-20 |
| 10879289 | Method for forming a semiconductor device | Chin-Yu Lin, Keng-Ying Liao, Huai-Jen Tung, Su-Yu Yeh, Chia-Yun Chen +1 more | 2020-12-29 |
| 10811423 | Method of fabricating semiconductor structure | Keng-Ying Liao, Yi-Jie Chen, Yi-Hung Chen | 2020-10-20 |
| 10665466 | Method for forming semiconductor device structure | Keng-Ying Liao, Chung-Bin Tseng, Yi-Hung Chen, Yi-Jie Chen | 2020-05-26 |
| 10658269 | Semiconductor structure and manufacturing method of the same | Tsung-Han Tsai, Volume Chien, Yung-Lung Hsu, Chung-Bin Tseng, Keng-Ying Liao | 2020-05-19 |
| 10269814 | Method of fabricating semiconductor structure | Keng-Ying Liao, Yi-Jie Chen, Yi-Hung Chen | 2019-04-23 |
| 10269684 | Semiconductor structure and manufacuting method of the same | Tsung-Han Tsai, Volume Chien, Yung-Lung Hsu, Chung-Bin Tseng, Keng-Ying Liao | 2019-04-23 |
| 10163646 | Method for forming semiconductor device structure | Keng-Ying Liao, Chung-Bin Tseng, Yi-Hung Chen, Yi-Jie Chen | 2018-12-25 |
| 10056316 | Manufacuting method of semiconductor structure | Tsung-Han Tsai, Volume Chien, Yung-Lung Hsu, Chung-Bin Tseng, Keng-Ying Liao | 2018-08-21 |
| 10008530 | Image sensing device and manufacturing method thereof | Keng-Ying Liao, Chung-Bin Tseng, Cheng-Hsien Chou, Jiech-Fun Lu, Yi-Hung Chen | 2018-06-26 |
| 9831154 | Semiconductor structure and manufacuting method of the same | Tsung-Han Tsai, Volume Chien, Yung-Lung Hsu, Chung-Bin Tseng, Keng-Ying Liao | 2017-11-28 |
| 9583356 | Method for forming semiconductor device structure | Keng-Ying Liao, Chung-Bin Tseng, Yi-Hung Chen, Yi-Jie Chen | 2017-02-28 |
| 9484376 | Semiconductor isolation structure and manufacturing method thereof | Yu WANG, Keng-Ying Liao, Yi-Hung Chen | 2016-11-01 |
| 8872301 | Dual profile shallow trench isolation apparatus and system | Chia-Yang Hung, Szu-Hung Yang, Chih-Cherng Jeng, Chih-Kang Chao, I-I Cheng | 2014-10-28 |
| 8803271 | Structures for grounding metal shields in backside illumination image sensor chips | Zhe-Ju Liu, Chih-Cherng Jeng, Kuo-Cheng Lee, Szu-Hung Yang, Chi-Chin Hsu | 2014-08-12 |